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Micron Technology on track to recruit engineers for new Lehi fab

25 August 2006 | By Mark Osborne | Recruitment News

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Since the major announcement of Intel Corp and Micron Technology to form a NAND Flash Joint Venture company, IM Flash Technologies and fit out and expand a dormant 300mm fab in Lehi, Idaho and directly generate around 2,000 high-tech jobs at the facility, there was concern that finding the qualified workers required for a major facility would be difficult, possibly delaying some of the plans as the start-up phase was seen as very aggressive.

However, in an interview with Mark Durcan, Micron's COO and CTO recently, Semiconductor Fabtech was told that plans for the Lehi fab are on schedule with cleanroom fit-out nearly completed and first phase tool install expected in the early part of the fourth quarter 2006. Production ramp is expected to start in early 2007, according to Durcan.


With respect to the recruitment drive that has been on-going soon after the JV was announced late last year, Durcan confirmed that the recruitment drive was on-track and has been assisted by the fact that the region has several very good universities that have well established engineering courses that cater well for the State's single largest private employer.


Recruitment is still on-going with a large list of job offerings are available online here;

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