Online information source for semiconductor professionals

Cadence taps engineering and design expertise in European Universities to form network

18 October 2007 | By Síle Mc Mahon | Recruitment News

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Cadence Design Systems’ plans for European Universities includes the set-up of a network-style agreement whereby member Universities and research institutes will agree to share research findings in the fields of design, verification and methodology with the design company. 

Universities were selected for their various skills and strengths in several areas, including RF and analog mixed-signal.  Cadence will provide all instruction, training and software required of the participants in return for their sharing of their findings with other academic and research institutions.  

To date, three universities have signed up for participation in the initiative.  The University of Heidelberg will take the lead role in high-level verification methodology; the Technical University of Ilmenau will focus on RF design methodology; and the Albert-Ludwigs-University of Freiburg will concentrate on the area of analog mixed-signal methodology.  Three other universities that are in the process of joining up are the University of Bristol in England, the Polytechnic University of Bucharest in Romania, and the University of Pavia in Italy.

Sean Redmond, Vice President, EMEA for Cadence, said: "With the increase in development of complex industrial electronic systems, our customers are finding that they need engineers with broad technology competence. This network provides an exchange platform for the industry, academia and Cadence to stimulate the use of leading-edge technology at these universities. We are enthusiastic about this initiative and believe that the broad portfolio of Cadence solutions provides a perfect instrument to transfer up-to-date design methodology."

By Síle Mc Mahon

Related articles

STMicroelectronics to collaborate with Chinese universities on CMOS processes - 30 May 2008

eSilicon appoints Rob Cadman to VP of European Sales and Operations - 29 October 2008

Si2 announces election of board of directors - 16 July 2009

SMIC selects Cadence DFM solution for 65/45nm production - 19 October 2009

Cadence announces several resignations including CEO - 15 October 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: