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Product Briefing Outline: Timbre Technologies, a TEL company, have launched the latest version of their Optical Digital Profilometry (ODP) technology, ODP 2006. The company has included a broad range of enhancements and expanded capabilities to improve scatterometry technology to control CD process conditions at the 65nm node.  ODP 2006 is included as part of Timbre's maintenance plans and is standard for all new orders.  It is also available to existing customers as an upgrade to their existing ODP systems. Read more >>

Product Briefing Outline: Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan has launched the Model AL3300 optical inspection and defect review system for full top, edge, bevel and back side inspection of 300 millimeter wafers. Read more >>

Product Briefing Outline: KLA-Tencor has launched the Surfscan SP2^XP, a new unpatterned wafer inspection system designed to meet 45nm IC manufacturing requirements for all types of bare wafers, including prime wafers, SOI (silicon-on-insulator), epitaxial and engineered substrates. Employing a proprietary five-channel inspection technology, the Surfscan SP2^XP is claimed to enable the detection of all major types of defects of interest.  The tool can then quickly group wafers into defect-free, re-workable and scrap categories based on type and number of defects. Improved detection enables wafer manufacturers to re-work many wafers that were previously scrapped, elevating yield and increasing profitability, according to the company. The new system has been extensively tested through beta partnerships with leading wafer suppliers, including Soitec, the largest supplier of SOI wafers in all sizes. Read more >>

Product Briefing Outline: Oxford Instruments has introduced its new TEOS delivery module for plasma-enhanced chemical vapour deposition (PECVD) of silicon dioxide (SiO₂) in its ‘Plasmalab' range of deposition tools. TEOS offers an alternative PECVD precursor to the commonly-used silane for applications such as photonics and dielectric layers in which high quality, conformal deposition of SiO₂ is required, according to the company.  The company has already received its first order for a complete PlasmalabSystem133 TEOS system incorporating the new module from a prestigious Chinese institute. Read more >>

Product Briefing Outline: The SEZ Group has launched the new ‘Esanti' platform targeting front-end-of-line (FEOL) cleaning and resist-stripping processes for 45nm and below. It builds on the company's core spin-processor technology, adding new capabilities that enhance defect removal and surface drying to effectively address a wide range of high-volume manufacturing applications. SEZ's proprietary Enhanced Sulfuric Acid ‘ESA' strip process is also optimized for deployment with the Esanti platform. SEZ reports that it has multiple Esanti systems in beta test with customers. Read more >>

Product Briefing Outline: Rudolph Technologies, Inc. has released its new ‘Synergy MPX' System, which combines Rudolph's patented ‘PULSE Technology' with new monochromatic microspot x-ray fluorescence (MMXRF) technology on a single tool platform. This new addition offers a production-worthy technique to measure the ultrathin opaque films, such as ALD layers, that will be required for next-generation processes. Read more >>

Product Briefing Outline: Applied Materials has introduced the ‘Applied Producer GT,' which it boldly claims is the industry's fastest, most cost-effective CVD1 platform. The Producer GT is said to be capable of processing 150 wafers per hour (wph), which doubles the throughput of any competitive system, and enables a 30% reduction in cost of ownership and a 50% increase in wph/m2 footprint, according to the company. The Producer GT supports the full portfolio of Applied's PECVD1 technology applications with more than 30 production-proven processes. Read more >>

Product Briefing Outline: SensArray Corporation has introduced the ‘Integral Wafer,' which is designed to collect insitu process information for certain critical, harsh environment process applications that would not otherwise be possible.  Integral Wafer has already been delivered to leading-edge semiconductor manufacturers and semiconductor equipment OEMs. Read more >>

Product Briefing Outline: Tokyo Electron (TEL) has introduced the company's latest 300mm metal CVD (chemical vapor deposition) system ‘Trias' LT Ti/TiN. The new system enables deposition of Ti (Titanium) and TiN (Titanium Nitride) films in low
temperature process regimes. Based on the industry-proven Trias platform, the Trias LT Ti/TiN meets the increasing demands for low temperature processing required
in the manufacture of nickel silicide contacts, without the need to migrate to alternative technologies. Read more >>

Product Briefing Outline: Mattson Technology has entered the growing rapid thermal oxidation (RTO) market with the launch of ‘Atmos,' based on the Helios RTP platform. Atmos is a dual-chamber, single-wafer 300mm RTP system for high-volume chip manufacturing through the 32nm technology node. Atmos enables a broad range of RTO applications, including selective oxidation and shallow-trench isolation. The thermal oxidation market segment is forecasted (Gartner) to be $112.4 million in 2006, with a compound annual growth rate of 25.9 percent from 2005 to 2011. Mattson has already received multiple orders for the new system and recently shipped the Atmos to a leading integrated device manufacturer for qualification at the 70nm node and below. Read more >>