Online information source for semiconductor professionals

Product Briefing Outline: Novellus Systems has launched the ‘VECTOR CFD’ family of films for the company’s VECTOR Express, VECTOR Extreme and VECTOR Excel plasma-enhanced chemical vapor deposition (PECVD) systems.  The Conformal Film Deposition (CFD) suite of dielectric films consists of oxide, doped oxide and nitride films are deposited at temperatures ranging from 50 degrees to 450 degrees Celsius.  These films provide solutions for emerging sub-2X nm logic and memory applications, including front-end-of-line (FEOL) liners and spacers used in tri-gate transistors and FinFETs, bitline spacers, and through silicon via (TSV) dielectric liners, amongst other applications. Read more >>

Product Briefing Outline: Applied Materials has launched a trio of new systems designed to boost performance in the next generations of DRAM chips. These systems are claimed to overcome key challenges in fabricating the transistor and contact areas of memory chips, include: the ‘Applied Centura DPN HD’ system to improve the gate insulator scaling; the ‘Applied Endura HAR Cobalt PVD’ system for high aspect ratio contact structures; and the ‘Applied Endura Versa XLR W PVD’ system for reduced gate stack resistance. Read more >>

Product Briefing Outline: Applied Materials has introduced the Applied ‘Vantage Vulcan’ rapid thermal processing (RTP) system. The system is claimed to supersede current RTP technology to bring a new level of precision and control to the anneal process, enabling chipmakers to reduce variability and boost production yields of their most highly-valued, highest-performing devices. Read more >>

Product Briefing Outline: Applied Materials has launched the ‘Applied Reflexion GTTM’ CMP system to cater for the planarization of tungsten films. This CMP process is critical to fabricating the transistor contacts and vias in advanced DRAM, NAND and logic devices. With the Reflexion GT system's proven dual-wafer architecture, it is claimed to have the highest throughput and more than 40% lower cost-per-wafer than competing systems. The system offers closed-loop film thickness and uniformity control - a vital capability to achieve high yields of today's advanced transistor structures. Read more >>

Product Briefing Outline: KLA-Tencor has introduced the ‘SpectraShape' 8660 and 8810 dimensional metrology systems that feature ‘AcuShape 2’ modeling software developed jointly with Tokyo Electron. The new SpectraShape tools are able to fully characterize the three dimensional shapes of complex features on ICs and monitor these shapes at production speeds. The system employs a user interface that allows fab engineers to build models on their own, keeping the details of their proprietary IC structures in-house. Read more >>

Product Briefing Outline: Applied Materials has launched the ‘Applied UVision’ 4 wafer inspection system, enabling IC manufacturers to detect yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. UVision 4 extends Applied’s DUV laser imaging technology to deliver the sensitivity and productivity needed to rapidly locate and identify defects previously unseen by any other inspection system. The UVision 4 system is already the tool of record at multiple leading flash manufacturers where it is used for 32nm production and in the development of 22nm and EUV lithography processes. Read more >>

Product Briefing Outline: Applied Materials has added to its line of 3D chip packaging solutions with the launch of its ‘Applied Producer InVia’ dielectric deposition system. Using a unique CVD process and chemistry, the InVia system deposits the critical oxide liner film layer in high aspect ratio (HAR) through-silicon via (TSV) structures. Providing conformal coverage over the full depth of these challenging features, the InVia process enables robust electrical isolation of the TSV – which is vital for reliable device performance.  Read more >>

Product Briefing Outline: ASM International has developed its ‘PowerFill’ epitaxial silicon (Epi Si) trench fill process, which enables void free filling of deep trenches with doped, epitaxial silicon. PowerFill is claimed to be about 3 times faster than competing processes, reducing manufacturing costs and creating an additional degree of freedom in power device design. Fairchild Semiconductor is the first customer to qualify the process for its advanced power management devices, having completed verification at its fab in Korea. ASM believes the new process enables power management devices and circuits to be realized in a smaller footprint thereby reducing die cost and form factor. Read more >>

Product Briefing Outline: Novellus Systems has introduced its next-generation ultra-violet thermal processing (UVTP) system, the SOLA xT. The SOLA xT is used in the manufacturing of advanced logic devices at 45nm and below and incorporates a proprietary UVTP treatment process that modifies the physical characteristics of a previously-deposited film through exposure to ultraviolet light and heat. The new system, featuring on-board UV monitoring and a customizable optics assembly, provides process flexibility and extendibility over multiple device generations. The first SOLA xT system will be shipped to UMC's Fab 12i in Singapore. Read more >>

Product Briefing Outline: Fujitsu and Digital Process (DIPRO) have announced the development of ICAD/SX V6L2 (version 6, level 2), a software package supporting the three-dimensional design of machinery and devices, which is now available in Japan. The ICAD/SX series has been developed based on the concept of ‘digital verification,’
where the design and production preparation stages take place concurrently, allowing users to shorten the time involved with the design and production of machinery and devices. Read more >>