Online information source for semiconductor professionals

Product Briefing Outline: FSI International has launched the ‘ORION’ Single Wafer Cleaning System, which is differentiated by the use of a unique closed chamber design permits complete control and containment of the wafer environment, addressing several cleaning-related issues on the critical path for 32nm and 22nm technologies. These include the reduction of material loss during photoresist stripping after ultra shallow implants and the elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal containing capping layers. Read more >>

Product Briefing Outline: FEI has launched the ‘Magellan’ series that is a new class of instruments called extreme high-resolution scanning electron microscopes (XHR SEMs). The Magellan XHR SEM allows scientists and engineers to quickly see things they could not see before, such as 3D surface images at many different angles and at resolutions below one nanometer (about the size of ten hydrogen atoms, side-by-side. The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below. Read more >>

Product Briefing Outline: Novellus Systems has now made available an ashable hard mask (AHM) process configuration for its ‘VECTOR Extreme’ PECVD platform. The new VECTOR Extreme AHM system is targeted at memory megafabs. More than 30 VECTOR Extreme platform systems are to be installed worldwide by the end of 2008, the company said. Read more >>

Product Briefing Outline: Rudolph Technologies has launched new ‘E30’ and ‘B30’ modules for wafer edge and backside inspection. The third-generation E30 and B30 modules provide improved sensitivity while maintaining high throughput, making them suitable for production environments. The new tools are equipped with the performance enhancements needed for inspection and in-line monitoring of 32nm manufacturing processes from front end of line (FEOL) through final manufacturing. The first shipments are scheduled for 4Q08. Read more >>

Product Briefing Outline: KLA-Tencor has introduced the ‘Surfscan SP2XP,’ with improved sensitivity to defects on silicon, poly and metal films and enhanced ability to sort defects by type and size, compared with its predecessor, the Surfscan SP2.  It also features vacuum handling and higher throughput. These capabilities are designed to enable chipmakers to bring their leading-edge (≥4Xnm) devices to market faster by delivering improved process tool monitoring throughout the fab. The new system also introduces an ultra-high sensitivity operating mode to accelerate fabs’ development of 3Xnm and 2Xnm next-generation devices. Read more >>

Product Briefing Outline: Nikon Instruments has introduced a new wafer loader NWL200 Series that is capable of loading wafers as thin as 100 micrometers. Using a new chuck system to transfer wafers, the NWL200 Series is claimed to achieve highly-reliable loading suitable for inspection of next-generation semiconductors. Previous systems could not be counted on to safely load wafers thinner than 300 micrometers, according to the company. Read more >>

Product Briefing Outline: Applied Materials is now offering the ‘Producer eHARP’ (enhanced High Aspect Ratio Process) system that extends the ‘HARP SACVD’ gap-fill technology for critical STI device structures to 32nm and beyond. The eHARP process has been developed to produce void-free films to fill <30nm, >12:1 aspect ratio features that are seen as being essential for the fabrication of advanced memory and logic devices. The eHARP process features new proprietary process innovations to enable high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures. Read more >>

Product Briefing Outline: Alchimer S.A. has introduced the ‘eG ViaCoat,’ an electrochemical coating processes, for the metallization of high aspect ratio through-silicon vias (TSVs) used in advanced 3D packaging applications. eG ViaCoat enables conformal, thin, uniform and adherent copper seed layers, even on resistive barriers. It is claimed to reduce processing costs over conventional dry vacuum processes. For example, for 10:1 aspect ratio TSVs, the CoO of eG ViaCoat is claimed to be 75% less than that of a traditional PVD (physical vapor deposition) process. Read more >>

Product Briefing Outline: FEI has launched the ‘Magellan’ series, a new class of instruments dubbed extreme high-resolution scanning electron microscopes (XHR SEMs). The Magellan XHR SEM allows scientists and engineers to quickly view elements such as 3D surface images from many different angles and at resolutions below one nanometer (about the size of ten hydrogen atoms, side-by-side). The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below. Read more >>

Product Briefing Outline: Lam Research has introduced the 2300 Versys Kiyo3x conductor etch series, which the company claims can achieve CD uniformity levels of 1nm across the wafer, a key requirement in double patterning lithography applications. The Kiyo3x is also field-upgradeable and can be used for high-k/metal gate, hardmask open, shallow trench isolation, and strained silicon etch applications. Multiple Kiyo3x systems have been installed at major customer sites in regions worldwide, according to the company. Read more >>