Online information source for semiconductor professionals

Product Briefing Outline: ASM International has developed its ‘PowerFill’ epitaxial silicon (Epi Si) trench fill process, which enables void free filling of deep trenches with doped, epitaxial silicon. PowerFill is claimed to be about 3 times faster than competing processes, reducing manufacturing costs and creating an additional degree of freedom in power device design. Fairchild Semiconductor is the first customer to qualify the process for its advanced power management devices, having completed verification at its fab in Korea. ASM believes the new process enables power management devices and circuits to be realized in a smaller footprint thereby reducing die cost and form factor. Read more >>

Product Briefing Outline: Novellus Systems has introduced its next-generation ultra-violet thermal processing (UVTP) system, the SOLA xT. The SOLA xT is used in the manufacturing of advanced logic devices at 45nm and below and incorporates a proprietary UVTP treatment process that modifies the physical characteristics of a previously-deposited film through exposure to ultraviolet light and heat. The new system, featuring on-board UV monitoring and a customizable optics assembly, provides process flexibility and extendibility over multiple device generations. The first SOLA xT system will be shipped to UMC's Fab 12i in Singapore. Read more >>

Product Briefing Outline: Fujitsu and Digital Process (DIPRO) have announced the development of ICAD/SX V6L2 (version 6, level 2), a software package supporting the three-dimensional design of machinery and devices, which is now available in Japan. The ICAD/SX series has been developed based on the concept of ‘digital verification,’
where the design and production preparation stages take place concurrently, allowing users to shorten the time involved with the design and production of machinery and devices. Read more >>

Product Briefing Outline: Applied Materials has introduced its new ‘Applied Vantage Astra’ millisecond anneal system used for transistor fabrication that enables faster, lower power consumption devices. Targeted for creating the sensitive nickel silicide (NiSi) transistor contact layers in 45nm and beyond logic chips the laser-based system can enhance drive current, and reduce gate leakage by an order of magnitude, helping to significantly increase device performance and yield. According to Applied, the compact design delivers more than twice the wafer output of competing systems and the lowest available cost of ownership (CoO). Read more >>

Product Briefing Outline: Applied Materials has launched the ‘Reflexion GT’ system for advanced metal CMP applications.  The system’s novel dual wafer design is claimed to set new benchmarks in CMP performance and productivity, delivering superior profile control and 60% higher throughput than competing systems. The Reflexion GT also dramatically cuts consumables cost, requiring up to 30% less slurry and processing twice as many wafers per polishing pad. Read more >>

Product Briefing Outline: Novellus Systems has developed a new suite of ashable hardmask (AHM) films that are claimed to have up to 25% greater etch selectivity compared to similar amorphous carbon films in use by the industry today. According to Novellus the highly selective and transparent (HST) AHM family of films has demonstrated die yield improvements as much as 7% when coupled with Novellus’ patented integrated edge bevel removal (EBR) technology. Read more >>

Product Briefing Outline: InnerSense LTD (a Ricor company) now offers a new wafer handling analysis product, the SMW2, for automated mechanical monitoring of the 300mm semiconductor process tools. The new product offering is based on over 6 years of experience in preventing excursions related to wafers’ micro-cracks and other mechanical defects, as well as providing capabilities to detect worn-out process tool mechanical components and to plan more effective periodic maintenance. Read more >>

Product Briefing Outline: Novellus Systems has launched the SABRE Excel, an advanced copper electroplating system designed to provide fill and defect density performance for the 22nm node and beyond. The platform features a new deposition module incorporating Novellus’ patented IRISCell technology, as well as new hardware, software and communications upgrades to the process tool’s mainframe. Additionally, an advanced plating process has been developed for SABRE Excel to take advantage of these new features. Read more >>

Product Briefing Outline: KLA-Tencor has extended its product offerings in the CMOS image sensor (CIS) market by announcing the 8900 defect inspection system. The system offers selectable illumination wavelengths, color-matched to CIS pixels; simultaneous brightfield and darkfield optical channels to enable capture of a wide variety of defect types; and adjustable sensitivity and throughput settings for cost-effective defect management from initial product development through volume production of color filter arrays (CFA). An 8900 defect inspection system was recently installed at the first 300mm advanced CFA fab of Toppan Printing. Read more >>

Product Briefing Outline: Novellus Systems has developed a multiple wavelength UV Thermal Processing (UVTP) treatment on the company’s ‘SOLA’ platform that results in a claimed 25% improvement in film hardness compared to a single wavelength treatment of the same k-value dielectric. It also enables the independent optimization of key UV treatment steps to enhance film performance while maintaining a high level of manufacturability. Read more >>