Online information source for semiconductor professionals

Product Briefing Outline: HORIBA Jobin Yvon has introduced the MM-16, a spectroscopic ellipsometer dedicated to the advanced characterization of film thickness and optical constants for a broad range of materials such as semiconductors, compounds, alloys and organic thin films. Read more >>

Product Briefing Outline: Metron Technology has launched its ‘Aquareus' system, in what it claims is the semiconductor industry's first and only point-of-use (POU) solution for abating copper from a CMP system's effluent stream. The Aquareus system's simplified treatment process enables chipmakers to meet the stringent liquid discharge limits at a lower cost and with less risk than complex back-pad methods, according to the company. Problem: A typical CMP tool running in production generates effluent containing approximately one hundred kilograms of copper per year. Aquareus concentrates copper by a factor of 200:1 for greater efficiency and cost-effectiveness than back-pad copper abatement methods. The Aquareus system's point-of-use design allows process flexibility and incremental growth capability as semiconductor fab operations expand. Read more >>

Product Briefing Outline: BOC Edwards has launched a new ‘EPMA'(electroplated metals abatement system) product, which offers simplified liquid waste treatment and lower cost of ownership than conventional approaches. Read more >>

Product briefing outline: ISIS sentronics has launched the SemDex 300 series wafer metrology system, that is designed to provide user defined thickness maps of substrates or other (multiple-) layers (for e.g. SOI) at repeatable rates down to 50nm. A wide range of materials including silicon, GaN, GaAs, SiC, Glass, Potoresist etc...can be evaluated, ranging from minimum 3-5µm up to about 1000µm. Other features such as bow/ warp, flatness, and wafer stress are also performed as well as surfacing profiling for mini-bumps can be achieved by exchanging the sensor head. Read more >>

Product Briefing Outline: MKS Instruments has developed the ‘LIQUOZON' LoopO3 fully integrated ozonated water delivery system. The system is designed to be an environmentally friendly and cost-effective alternative to existing semiconductor cleaning technologies, especially in low flow applications. The system is compact and stand-alone and features fast cycle times and up to 12 L/min of DIO3 at ozone concentrations to 40/75 ppm, ideal specifications for single wafer applications, according to the company. Read more >>

Product Briefing Outline: ATMI has introduced a new copper electrochemical deposition process for producing semiconductor chips with advanced copper interconnects in partnership with Enthone and Novellus Systems. The new chemistry and process were developed for Novellus Systems' SABRE tool for the 45nm process node. The ATMI-Enthone ‘Viaform Extreme' process is claimed to offer significant enhancements that meet stringent performance requirements for low defect rates, uniformity, and electrical performance.  The chemistry and associated processes have been validated at leading semiconductor manufacturers, according to the companies. Read more >>

Product Briefing Outline: Metara has introduced the ‘SENTRY' Harsh Chemistry Metrology (HCM) system that the company claims is the first of its kind to be able in fully automated mode to analyze harsh ultra-pure chemicals for metallic contamination excursions. Read more >>

Product Briefing Outline: Mallinckrodt Baker has introduced its ‘ALEG-380' photoresist stripper and residue remover as a cost-effective alternative to hydroxylamine-based chemistries in aluminum IC manufacturing processes. ALEG-380 is 100% water-soluble formulation that does not require an intermediate rinse, helping fabs improve yields and reduce manufacturing costs. Read more >>