Product Briefing Outline: HORIBA Jobin Yvon has
introduced the MM-16, a spectroscopic ellipsometer dedicated to the
advanced characterization of film thickness and optical constants for a
broad range of materials such as semiconductors, compounds, alloys and
organic thin films.
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Product Briefing Outline: Metron Technology has
launched its ‘Aquareus' system, in what it claims is the semiconductor
industry's first and only point-of-use (POU) solution for abating
copper from a CMP system's effluent stream. The Aquareus system's
simplified treatment process enables chipmakers to meet the stringent
liquid discharge limits at a lower cost and with less risk than complex
back-pad methods, according to the company.
Problem: A typical CMP tool running in production generates
effluent containing approximately one hundred kilograms of copper per
year. Aquareus concentrates copper by a factor of 200:1 for greater
efficiency and cost-effectiveness than back-pad copper abatement
methods. The Aquareus system's point-of-use design allows process
flexibility and incremental growth capability as semiconductor fab
operations expand.
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Product Briefing Outline: BOC Edwards has launched a
new ‘EPMA'(electroplated metals abatement system) product, which offers
simplified liquid waste treatment and lower cost of ownership than
conventional approaches.
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Product briefing outline: ISIS sentronics has launched
the SemDex 300 series wafer metrology system, that is designed to
provide user defined thickness maps of substrates or other (multiple-)
layers (for e.g. SOI) at repeatable rates down to 50nm. A wide range of
materials including silicon, GaN, GaAs, SiC, Glass, Potoresist
etc...can be evaluated, ranging from minimum 3-5µm up to about 1000µm.
Other features such as bow/ warp, flatness, and wafer stress are also
performed as well as surfacing profiling for mini-bumps can be achieved
by exchanging the sensor head.
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Product Briefing Outline: MKS Instruments has
developed the ‘LIQUOZON' LoopO3 fully integrated ozonated water
delivery system. The system is designed to be an environmentally
friendly and cost-effective alternative to existing semiconductor
cleaning technologies, especially in low flow applications. The system
is compact and stand-alone and features fast cycle times and up to 12
L/min of DIO3 at ozone concentrations to 40/75 ppm, ideal
specifications for single wafer applications, according to the company.
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Product Briefing Outline: ATMI has introduced a new
copper electrochemical deposition process for producing semiconductor
chips with advanced copper interconnects in partnership with Enthone
and Novellus Systems. The new chemistry and process were developed for
Novellus Systems' SABRE tool for the 45nm process node. The
ATMI-Enthone ‘Viaform Extreme' process is claimed to offer significant
enhancements that meet stringent performance requirements for low
defect rates, uniformity, and electrical performance. The chemistry
and associated processes have been validated at leading semiconductor
manufacturers, according to the companies.
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Product Briefing Outline: Metara has introduced the
‘SENTRY' Harsh Chemistry Metrology (HCM) system that the company claims
is the first of its kind to be able in fully automated mode to analyze
harsh ultra-pure chemicals for metallic contamination excursions.
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Product Briefing Outline: Mallinckrodt Baker has
introduced its ‘ALEG-380' photoresist stripper and residue remover as a
cost-effective alternative to hydroxylamine-based chemistries in
aluminum IC manufacturing processes. ALEG-380 is 100% water-soluble
formulation that does not require an intermediate rinse, helping fabs
improve yields and reduce manufacturing costs.
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