Online information source for semiconductor professionals

Product Briefing Outline: Applied Chemical Laboratories has introduced ‘ACL-585 HiPER-Solv’ (patents pending), a high performance etch residue solvent that is claimed to realize a significant improvement in removal of post-etch hardened polymers and polymer residue from metal and via etch processes when compared with conventional hydroxylamine or solvent-amine products. ACL-585 is specifically formulated for advanced sub-90 nm design rules that incorporate high density plasma etch. The solvent is new non-corrosive and environmentally benign. Read more >>

Product Briefing Outline: Tiger Optics has recently unveiled the HALO+, a mini-Cavity Ring-Down Spectroscopy (CRDS) analyzer capable of measuring moisture from 200 parts-per-trillion to 20 parts-per-million levels. It offers similar dynamic range for other detections as well.  An evolution of the compact HALO analyzer, the new HALO+ is equally small, but offers greater sensitivity, and communication, analysis, and trending capabilities comparable to Tiger's flagship LaserTrace and MTO analyzers. Read more >>

Product Briefing Outline: Cabot Microelectronics has claimed a major breakthrough in its CMP technology with improvements to its B6600 platform of barrier CMP slurries for advanced technology nodes. B6600 barrier slurry platform is tunable, enabling the products to be easily customized to deliver improved planarity and defect performance across a wide range of integration schemes. The B6600 barrier slurry products are being produced and used worldwide for technology nodes from 90nm through 45nm, according to the company. Read more >>

Product Briefing Outline: Carl Zeiss SMT has officially launched the ‘ORION' Helium ion microscope based on proprietary intellectual property developed by ALIS Corporation, a Peabody, Massachusetts-based start-up company acquired by Carl Zeiss SMT in 2006. According to Carl Zeiss SMT, this new microscope is capable of providing images of unrivalled high resolution, surface information and material contrast, unachievable with any other microscopy instrument available today. Read more >>

Product Briefing Outline: Ferro Electronic Material Systems has introduced a patent-pending self-stopping chemical mechanical planarization (CMP) slurry for Inner Layer Dielectric (ILD) materials. Ferro claims the new slurry provides planarization efficiency of > 95% with an increased over-polish window and eliminates the need for endpoint detection.  ‘SureStop' 8500 offers improved efficiency and uniformity with lower defectivity compared to standard ILD CMP slurries and is now being used to simplify planarization processes that employ reverse mask etchback steps. Read more >>

Product Briefing Outline: Ferro Electronic Material Systems has formulated patented high selectivity shallow trench isolation (STI) CMP slurries with an optimized low defectivity ceria particle that enable high-yield processes for next-generation devices.  ‘TruPlane™ 8272' is performing successfully in high-volume manufacturing of 65nm technology Flash devices, according to the company. Read more >>

Product Briefing Outline: Cabot Microelectronics has claimed a major breakthrough in its CMP technology with the ‘WIN' platform of tungsten (W) CMP slurries for advanced technology nodes. The WIN product line is non-hazardous and environmentally friendly as it is based on hydrogen peroxide technology. The product platform is composed of two main product classes: ‘WIN W7000' and ‘WIN W7300.' Read more >>

Product Briefing Outline: BOC Edwards has introduced the ‘HELIOS 6' gas abatement solution that uses its unique inward-fired combustion technology for high hydrogen flow processes, such as Si and SiGe epitaxy, LPCVD tungsten and compound semiconductor MOCVD. Both the HELIOS product line and the proprietary inward-fired combustor technology that it incorporates are well-established industry standards. BOC Edwards has installed hundreds of HELIOS systems and thousands of combustors worldwide. Read more >>

Product Briefing Outline: ATMI has introduced a new product line for 300mm wafer reclaim applications called ‘RegenSi Wafer Reclaim Solutions.' ATMI's formulas are designed for dielectric removal and are semi-aqueous, fluoride-based solutions with low viscosity, and are therefore easily rinsed with water. They are designed to work with either batch or single wafer spray tools. Read more >>

Product Briefing Outline: Toshiba Corporation, Shibaura Mechatronics Corporation and Chlorine Engineers Corp. have co-developed an innovative semiconductor resist stripping technology that employs electrolyzed sulfuric acid. It is the first time that electrolyzed sulfuric acid has been applied to resist stripping, according to the companies. The partners have already developed a single-wafer resist-stripping system that will be integrated into the resist-stripping process at Toshiba's Yokkaichi Operations in April 2007. Read more >>