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Product Briefing Outline: SAFC Hitech has made significant progress in developing Germanium Antimony Telluride (GexSbyTez or GST) precursors for use in high volume manufacturing phase change memory (PCM) applications. Extensive development work has been conducted with both the precursors and with the use of conventional Metal-Organic Chemical Vapor Deposition (MOCVD) techniques to deposit them, resulting in the successful deposition of device-quality GST. Read more >>

Product Briefing Outline: Air Products and Chemicals has introduced its new ‘XeCovery’ on-site xenon recovery service for the semiconductor and MEMS industries. Xenon has a number of unique properties that have attracted a variety of industries to use this atom, including semiconductor manufacturing. With demand and prices on the rise, there is a growing concern that cost will hamper its applicability. Air Products uses its patented Vacuum Swing Adsorption (VSA) technology as a means for recovering xenon from effluent gas streams. Read more >>

Product Briefing Outline: Matheson Tri-Gas Electronics has introduced its patented ‘PICO-TRAP’ Ultra-Purification System for removing volatile metal impurities and moisture from critical process gases used by semiconductor manufacturers. The PICO-TRAP System combines the principles of chemisorption and physisorption to achieve higher levels of process gas purity than by conventional purification technologies, according to the company. Read more >>

Product Briefing Outline: SAFC Hitech has introduced the ‘EpiVapor’, a metalorganic vapor phase distribution system for compound semiconductor manufacturing. EpiVapor is designed to eliminate the need for localized tool bubblers and TCUs by delivering vapors from highly volatile and sensitive pyrophoric liquids directly to MOCVD systems. Read more >>

Product Briefing Outline: SAFC Hitech has introduced the OM700, a bubbler that offers a cost-efficient migration path to controlled precursor delivery for larger lot sizes, enabling a reduction in process downtime, combined with increased safety controls. Read more >>

Product Briefing Outline: Veeco Instruments has introduced the ‘HarmoniX’, a powerful new atomic force microscope (AFM) technique for high-resolution nanoscale imaging and analysis. Veeco’s HarmoniX Nanoscale Material Property Mapping enables AFM users to simultaneously, and in real-time, acquire high-resolution images as well as high-resolution, quantitative material property maps. This technique is effective for characterization of soft materials, thin films, small particles, or domains within a bulk solid. Read more >>

Product Briefing Outline: Edwards has introduced the new iXH series of vacuum pumps, used for harsh process environments. Designed to meet the increasing demands of the emerging processes required for semiconductor manufacturing at 60nm and smaller design rules, the iXH is designed to help reduce tool cost-of-ownership (CoO) with a smaller footprint than previous generations, and also features a modular design that enables a quicker response to emerging process requirements. Read more >>

Product Briefing Outline: Levitronix has introduced the new ‘BPS 600’ magnetically levitated pump technology, designed for demanding applications in the semiconductor industry such as CMP slurry delivery, copper electroplating and wafer cleaning at leading-edge process nodes. The patented impeller floats in a magnetic field only touching the fluid it is pumping, and can be fully integrated into a fully-closed loop electronic control system without the need of additional controller hardware. Read more >>

Product Briefing Outline: Rohm and Haas Electronic Materials’ CMPTechnologies division has introduced the ‘VisionPad’ 5000 CMP pad, specifically designed for defectivity reduction in shallow trench isolation (STI) and interlayer dielectric (ILD) applications. The new pad targets volume manufacturing of memory and logic chips at 65nm and below. Read more >>

Product Briefing Outline: Applied Chemical Laboratories has introduced ‘ACL-585 HiPER-Solv’ (patents pending), a high performance etch residue solvent that is claimed to realize a significant improvement in removal of post-etch hardened polymers and polymer residue from metal and via etch processes when compared with conventional hydroxylamine or solvent-amine products. ACL-585 is specifically formulated for advanced sub-90 nm design rules that incorporate high density plasma etch. The solvent is new non-corrosive and environmentally benign. Read more >>