Product Briefing Outline: Entegris has introduced its
‘LiquidLens' ultrapure water (UPW) purification system that is designed
specifically for 193nm ArF immersion lithography systems. The
sub-system combines advanced technology and process expertise from both
Entegris and the former Mykrolis as a result of their merger in August
2005 to tackle high-purity issues associated with the needs of
immersion lithography.
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Product Briefing Outline: JEOL, has introduced a new
high precision direct write e-beam lithography system. The new
JBX-6300FS is a spot beam, vector scan, step and repeat lithography
system designed for high volume direct patterning on wafers, and is
capable of writing minimum line widths of 8nm, according to the
company. 2-inch to 200mm wafers can be accommodated, as well as parts
and pieces. An autoloader allows continuous unattended operation of up
to 10 cassettes under vacuum.
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Product Briefing Outline: SII Nano Technology has
launched "SmartMRC" mask rule checker software package that is designed
to be used for mask data verification as part of the requirement for
manufacturing and inspection of advanced photomasks. SmartMRC was
jointly developed with Dai Nippon Printing Co., Ltd. and will be
available from April 2006.
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Product Briefing Outline: Picarro, a manufacturer of
high performance lasers and laser-based instruments, has begun
commercial shipments of its next generation ammonia measurement
instrument. The instrument, the ESP-1000, is based on Picarro's
patented Cavity Ring Down Spectroscopy (CRDS) and achieves better than
1 part-per billion detection of ammonia in ambient air, according to
the company.
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Outline: Aprio Technologies has launched Halo-iOPC,
the company's first product with features intended for both the design
and manufacturing communities. Halo-iOPC, a superset of Aprio's optical
proximity correction (OPC) product, is the first of its second-phase
products that begin to enable better collaboration between design and
manufacturing.
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Product Briefing Outline: KLA-Tencor has launched its
next-generation photomask inspection system, STARlight-2TM. The system
is claimed to be the most cost-effective contamination inspection
solution in the industry for all types of photomasks, including
mainstream extreme resolution enhancement technique (XRET) photomasks,
at the 65nm node and below. According to KLA-Tencor the use of a
revolutionary image processing technology is at the heart of the
systems performance. The system has been designed for the detection of
progressive defects--an increasingly critical class of yield killers
that impact device yield over time and can cause catastrophic device
reliability problems.
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Product Briefing Outline: Invarium, Inc has unveiled
"DimensionPPC," which it claims to be the industry's first unified,
full-chip Process and Proximity Compensation (PPC) product for
patterning integrated circuit (IC) layouts at 65 nm and below.
Architected from the ground up as a new-generation layout-to-mask
solution, DimensionPPC is intended to overcome the deficiencies of
today's RET/OPC tools and layout correction techniques for other
process effects, from mask through etch. The product has been
fab-validated at 65nm during the fourth quarter of 2005. The technology
is currently in production deployment at one customer site and is being
qualified for production use by five additional leading semiconductor
manufacturers.
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Product Briefing Outline: KLA-Tencor has launched its latest-generation
optical CD metrology system, the SpectraCD-XT, which provides inline CD
and profile measurements of critical device structures that help enable
early prediction of IC performance and yield at the 90-nm and 65-nm
nodes. The only high-performance spectroscopic ellipsometry (SE)-based
CD metrology tool with sub-two-second move-acquire-measure (MAM) time,
SpectraCD-XT provides a two-fold increase in throughput (to more than
100 wph) compared to the previous-generation platform at comparable
performance, according to the company.
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