Product Outline: Brion Technologies, a division of ASML, has launched
the Tachyon Flexible Mask Optimization (Tachyon FMO), part of ASML’s
Holistic Lithography portfolio. Tachyon FMO is claimed to enable the
seamless use of multiple Optical Proximity Correction (OPC) techniques
in a single mask tapeout, permitting the use of advanced and
computationally intensive OPC in key local areas where they provide
maximum benefit.
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Product Briefing Outline: Applied Materials has introduced its
new ‘Applied Centura Tetra’ EUV Advanced Reticle Etch system. The new
systems is claimed to overcome a major hurdle to the adoption of EUV
lithography by solving the critical and unmet challenge of etching EUVL
photomasks with nanometer-level accuracy and world-class defect
performance to enable the fabrication of multiple new generations of
high-performance semiconductor chips at the 16nm node and below.
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Product Briefing Outline: Brion Technologies, a division of ASML,
has launched a new product for its Tachyon computational lithography
platform. Tachyon MB-SRAF (Model-Based Sub-Resolution Assist Features)
is said to enable the high-speed, full-chip processing of advanced chip
designs with larger process windows, greater productivity, and lower
development costs than rule-based alternatives.
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Product Briefing Outline: ASML has introduced three new extensions for
TWINSCAN NXT platform that improve imaging, overlay and productivity.
The extensions enable chipmakers to manufacture smaller, faster chips
more cost-effectively. The first NXT:1950i system shipped in 2009 and
today more than 80 systems are in use by chipmakers around the world
manufacturing current state-of-the-art devices at resolutions of 45- to
32-nm.
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Product Briefing Outline: Canon has entered the semiconductor
back-end manufacturing tool market with the launch of the FPA-5510iV for
next-generation semiconductor packaging, which is specially designed
for ‘Through Silicon Via’ (TSV) and ‘bump’ processes.
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Product Briefing Outline: Nikon’s new S620D incorporates a
multi-axial catadioptric lens with a 1.35 NA that will satisfy the
imaging requirements to enable DP for 32nm and future technology
generations. This lens design delivers extremely low aberrations and
minimized local flare. In addition, the S620D design enables active
aberration control, and enhances CD uniformity with dose and focus
feedback and tuning capabilities that further increase yield. The S620D
has already satisfied the aggressive CDU requirements for lines and
spaces at 32nm, and demonstrated 22nm patterning capabilities,
confirming extendibility to next generation applications.
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Product Briefing Outline: Synopsys has introduced Proteus LRC for
lithography verification at the 2011, SPIE Advanced Lithography
conference. Proteus LRC provides comprehensive, process-window-aware
checking features to identify locations in a design that are sensitive
to process variations, thereby enabling corrective action to be taken
prior to committing a design to manufacture. Proteus LRC is integrated
into the Proteus Mask Synthesis flow and is targeted for use by OPC and
mask data preparation groups at semiconductor manufacturers.
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Product Briefing Outline: At the 2011, SPIE Advanced Lithography
Conference, Cymer has announced the development of new focus drilling
technology for its immersion light sources including the XLR 600ix,
XLR500i, XLA 400 and XLA 300. According to Cymer, focus drilling
provides up to a 2X improvement in the depth of focus on the wafer,
thereby enabling a larger process window that can positively impact
chipmakers' yield.
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Product Briefing Outline: USHIO is to exhibit and participate in
the SPIE Advanced Lithography 2011, highlighting a new nano-imprint VUV
(Vacuum Ultra Violet) ashing system ‘CHIPs’ (Compact HiPower System),
which is designed to be incorporated into nano-imprint lithography (NIL)
equipment.
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Product Briefing Outline: Next generation semiconductor production will
be facilitated by a new product introduced by Brion Technologies, a
division of ASML. Brion’s new Tachyon NXE is the result of a multi-year
investment by ASML and Brion to accurately model the performance of NXE
scanners, which are designed to provide accurate predictive modeling
specifically for ASML Extreme Ultraviolet (EUV) scanners. The accurate
EUV modeling in Tachyon NXE is claimed to reduce both the development
time and cost to produce chips on EUV systems.
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