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‚??SpectraShape‚?? metrology tool from KLA-Tencor and TEL enables characterization of complex struct

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Product Briefing Outline: KLA-Tencor has introduced the ‘SpectraShape' 8660 and 8810 dimensional metrology systems that feature ‘AcuShape 2’ modeling software developed jointly with Tokyo Electron. The new SpectraShape tools are able to fully characterize the three dimensional shapes of complex features on ICs and monitor these shapes at production speeds. The system employs a user interface that allows fab engineers to build models on their own, keeping the details of their proprietary IC structures in-house.

Problem: Despite considerable process control challenges, IC manufacturers have begun to incorporate geometrically complex structures in order to garner more performance from each square centimeter of a silicon wafer. For these structures, the top-down view that a critical dimension scanning electron microscope (CD-SEM) provides may not be sufficient for ensuring that the structures are being built to specifications. This can also lead to more ways for small process variations to affect device performance.

Solution: KLA-Tencor's new SpectraShape systems use a diverse array of optical technologies to characterize the structures comprehensively and rapidly. Optical dimensional metrology requires advanced mathematical modeling to interpret the signals from the hardware, and the new AcuShape2 software streamlines the modeling process for both KLA-Tencor's standalone and TEL's integrated metrology (IM) systems. The algorithms combine and analyze the multiple signals to produce a detailed description of the shape of an IC feature and identify any deviations beyond allowed tolerances. With their multi-channel design, the SpectraShape 8660 and 8810 systems have broad applicability across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers.

Characterization and production monitoring of geometrically complex structures.

Platform: The SpectraShape 8660 and 8810 with AcuShape2, feature flexible hardware with patented ability to combine signals from multiple channels to characterize highly complex IC structures. New model building user interface, designed for use by fab engineers with or without assistance from outside experts. The system produces accelerated model building and reduced measurement time compared with previous-generation KLA-Tencor optical CD tools. The SpectraShape 8810 differs from the 8660 by adding a deep ultraviolet (DUV) illumination option to improve sensitivity for advanced materials.

Availability: March 2011 onwards.

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