Online information source for semiconductor professionals

‚??SpectraShape‚?? metrology tool from KLA-Tencor and TEL enables characterization of complex struct

Popular articles

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

Product Briefing Outline: KLA-Tencor has introduced the ‘SpectraShape' 8660 and 8810 dimensional metrology systems that feature ‘AcuShape 2’ modeling software developed jointly with Tokyo Electron. The new SpectraShape tools are able to fully characterize the three dimensional shapes of complex features on ICs and monitor these shapes at production speeds. The system employs a user interface that allows fab engineers to build models on their own, keeping the details of their proprietary IC structures in-house.

Problem: Despite considerable process control challenges, IC manufacturers have begun to incorporate geometrically complex structures in order to garner more performance from each square centimeter of a silicon wafer. For these structures, the top-down view that a critical dimension scanning electron microscope (CD-SEM) provides may not be sufficient for ensuring that the structures are being built to specifications. This can also lead to more ways for small process variations to affect device performance.

Solution: KLA-Tencor's new SpectraShape systems use a diverse array of optical technologies to characterize the structures comprehensively and rapidly. Optical dimensional metrology requires advanced mathematical modeling to interpret the signals from the hardware, and the new AcuShape2 software streamlines the modeling process for both KLA-Tencor's standalone and TEL's integrated metrology (IM) systems. The algorithms combine and analyze the multiple signals to produce a detailed description of the shape of an IC feature and identify any deviations beyond allowed tolerances. With their multi-channel design, the SpectraShape 8660 and 8810 systems have broad applicability across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers.

Applications:
Characterization and production monitoring of geometrically complex structures.

Platform: The SpectraShape 8660 and 8810 with AcuShape2, feature flexible hardware with patented ability to combine signals from multiple channels to characterize highly complex IC structures. New model building user interface, designed for use by fab engineers with or without assistance from outside experts. The system produces accelerated model building and reduced measurement time compared with previous-generation KLA-Tencor optical CD tools. The SpectraShape 8810 differs from the 8660 by adding a deep ultraviolet (DUV) illumination option to improve sensitivity for advanced materials.

Availability: March 2011 onwards.
 

Related articles

In-line electrical metrology for high-k gate dielectrics deposited by atomic layer chemical vapour d - 01 September 2002

Veeco‚??s 3D AFM tool starts EUVL resist reference work at SEMATECH - 06 July 2009

Metrology market consolidation marches on - 01 April 2009

Measurement of Advanced Low K Materials - 01 March 1999

Measurement of Advanced Low K Materials - 01 March 1999

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: