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New Product: TSMC targets 32nm DFM requirements with a new unified design methodology
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Product Briefing Outline: TSMC has introduced a new
Unified Design For Manufacturing (UDFM) architecture that targets 32nm
process technology and smaller geometries and improves yields, lowers
design costs and accelerates time-to-market and time-to-volume. The
UDFM is intended to provide a unified, encapsulated access to TSMC
foundry data and was developed in collaboration with EDA vendors and
other design infrastructure partners. The TSMC UDFM is also one of the
key collaborative components of the company's recently unveiled Open
Innovation Platform. Open Innovation Platform is a platform for
innovations, hosted by TSMC and open to TSMC customers and partners. It
is built on TSMC's design-enabling building blocks and an ecosystem
interface.
Problem: There is a greater need for methods to
compensate for increasing manufacturing variances in advanced process
technologies that improve design alignment between simulated hotspots
and actual manufacturing hotspots, and deliver timely accuracy to the
design ecosystem. The new DFM architecture handles very large DFM
dataset and design complexity, which is designed to reduce design cycle
time and provide a faster time-to-market and volume.
Solution: The
UDFM architecture includes a new DFM Design Kit (DDK) that for the
first time encapsulates an embedded DFM software engine with an
interoperable API in addition to the process-related DFM data and
models. UDFM brings an exact copy of TSMC's factory tool chain and
process models into IC design tool chains, providing chip designers
with deeper access into more of TSMC's manufacturing data than ever
before.
Applications: 32nm IC designs and below using TSMC processes.
Platform: UDFM
is also one of the key collaborative components of the company's
recently unveiled Open Innovation Platform. Open Innovation Platform is
a platform for innovations, hosted by TSMC and open to TSMC customers
and partners. It is built on TSMC's design-enabling building blocks and
an ecosystem interface.
Availability: Early Q3 2008 to registered members through the TSMC customer portal.