Online information source for semiconductor professionals

New Product: TSMC targets 32nm DFM requirements with a new unified design methodology

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

TSMCProduct Briefing Outline: TSMC has introduced a new Unified Design For Manufacturing (UDFM) architecture that targets 32nm process technology and smaller geometries and improves yields, lowers design costs and accelerates time-to-market and time-to-volume. The UDFM is intended to provide a unified, encapsulated access to TSMC foundry data and was developed in collaboration with EDA vendors and other design infrastructure partners. The TSMC UDFM is also one of the key collaborative components of the company's recently unveiled Open Innovation Platform. Open Innovation Platform is a platform for innovations, hosted by TSMC and open to TSMC customers and partners. It is built on TSMC's design-enabling building blocks and an ecosystem interface.

Problem: There is a greater need for methods to compensate for increasing manufacturing variances in advanced process technologies that improve design alignment between simulated hotspots and actual manufacturing hotspots, and deliver timely accuracy to the design ecosystem. The new DFM architecture handles very large DFM dataset and design complexity, which is designed to reduce design cycle time and provide a faster time-to-market and volume.

Solution: The UDFM architecture includes a new DFM Design Kit (DDK) that for the first time encapsulates an embedded DFM software engine with an interoperable API in addition to the process-related DFM data and models. UDFM brings an exact copy of TSMC's factory tool chain and process models into IC design tool chains, providing chip designers with deeper access into more of TSMC's manufacturing data than ever before.

Applications: 32nm IC designs and below using TSMC processes.

Platform: UDFM is also one of the key collaborative components of the company's recently unveiled Open Innovation Platform. Open Innovation Platform is a platform for innovations, hosted by TSMC and open to TSMC customers and partners. It is built on TSMC's design-enabling building blocks and an ecosystem interface.

Availability: Early Q3 2008 to registered members through the TSMC customer portal.

Related articles

New Product: TSMC‚??s iDRC and iLVS data formats support 40nm process IC designs - 21 July 2009

TSMC offers production ready EDA files for 65nm, 40nm and 28nm nodes - 06 April 2010

TSMC and Synopsys tackle 28nm lithography hotspots - 24 June 2009

TSMC squeezes 28nm node into roadmap for 2010 - 29 September 2008

Cadence taps engineering and design expertise in European Universities to form network - 18 October 2007

Reader comments

Nice technology. I will surely try this one.
By Stephani on 02 December 2008

Post your comment

Name:
Email:
Please enter the word you see in the image below: