Online information source for semiconductor professionals

New Product: Toppan Photomasks’ new DFM tool analyses defects and design errors

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

DFMProduct Briefing Outline: Toppan Photomasks has introduced a new DFM tool that will shorten cycle time and reduce risk in chip design through an exception dispositioning process for identifying and analyzing defects and design errors. The tool was developed in collaboration with Anchor Semiconductor, Inc. and is an extension of that company’s ‘NanoScope’ DFM platform. It allows designers and tapeout engineers to review “exceptions” found during the processing of customer data and masks.

Problem: While photomask suppliers traditionally have provided their customers’ exception data for review, the typical report format limits the customers’ ability to analyze the defect in context with surrounding data. The additional work and associated uncertainty can delay customer release of the data for mask manufacturing.

Solution: Toppan’s new tool will provide customers this contextual analysis by utilizing the powerful geometric figure-handling capabilities of the Anchor NanoScope platform. Engineers will easily be able to determine the design or lithographic relevance of the exception in question and make informed decisions on whether to repair or waive the exception. In the case of MRC violations, the new tool also enables the engineer to review any “do not inspect regions” (DNIRs) proposed to resolve the MRC violations without correcting the pattern data.

Applications: Identifying and analyzing defects and design errors

Platform:
The NanoScope platform enables a family of products covering a wide range of applications, include design hotspot identification, special RET and OPC, OPC verification, photomask inspection, silicon wafer printing and defect inspection.

Availability: February 2008 onwards.

Related jobs

Quality Assurance Engineer - Tokyo Electron Limited - Santa Clara , 30 October 2007

Analog Design Engineer - AMI Semiconductor - Sunnyvale, 10 August 2007

Technical Support Engineer - Carl Zeiss SMT, Inc. - Peabody, 10 August 2007

Electrical engineering - Axcelis - Beverly, 10 August 2007

Senior Applications Engineer - Axcelis - Beverly, 09 August 2007

Related articles

Chinese Foundry CSMC picks Toppan Photomasks as best supplier - 19 March 2008

New Product: New DFM suite from Synopsys aims to shorten correction, correlation & completion tasks. - 23 August 2006

New Product: Takumi targets hot spot IC design issues with two new tools - 28 November 2006

Optical Simulation of 3D Mask Effects - 01 June 2000

New Product: New wafer defect review system from KLA-Tencor addresses SEM Non-Visual defects - 04 July 2007

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: