Online information source for semiconductor professionals

New Product: SOKUDO‚??s new RF3T system pushes 200wph throughput

03 December 2007 | By Mark Osborne | Product Briefings > Lithography

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

SokudoProduct Briefing Outline: SOKUDO has introduced its new RF3T system - the company's highest productivity, lowest cost-of-ownership (CoO) coat/develop track system targeted for the full range of lithography applications. This system significantly extends the capabilities of SOKUDO's established RF3 platform to achieve world-class 200 wafer per hour (wph) throughput, keeping pace with the fastest lithography scanners while maintaining process transparency. 

Problem: Lithography track systems are required to meet both the process performance requirements from demanding immersion lithography applications while matching the throughput and cycle-time requirements. Increased defectivity requirements coupled to additional process steps within the track require continued development of track systems.

Solution: To achieve a 10 percent throughput improvement over the RF3S, the RF3T system features additional parallel process modules and higher efficiency wafer transport. The develop cell has been reconfigured for eight develop modules in the same platform footprint to provide 60 percent higher develop and rinse process capability than the previous system. A novel wafer coating dispense system significantly reduces chemical
consumption, the largest contributor to track operating cost. When combined, these features provide lower CoO and higher process performance for lithography applications.

Applications: Immersion ArF <0.1 defects/cm2 by SDC Soak. ArF, KrF, i-line, BARC, SOG, Color filter, to name but a few. The system has an integrated OCD metrology option.

Platform: RF3T system is based on the production proven RF3 platform, which had over 200 systems installed in both 200 and 300mm wafer configurations.

Availability: December 2007 onwards.

Sokudo

Related articles

SOKUDO claims 300wph throughput for lithography track system - 07 May 2009

New Product: Applied Materials‚?? Inflexion edge polishing system cleans in a single pass - 14 May 2008

Tool Order: Samsung Electronics selects Jordan Valley’s X-ray metrology system - 18 May 2009

New Product: Intevac‚??s novel ‚??Lean Etch‚?? platform posts 200wph productivity - 24 August 2007

New Product: ULVAC Technologies cuts cost of resist strip processes with Enviro ‚??Optima‚??s small - 29 August 2006

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: