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New Product: SOKUDO‚??s new RF3T system pushes 200wph throughput

03 December 2007 | By Mark Osborne | Product Briefings > Lithography

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SokudoProduct Briefing Outline: SOKUDO has introduced its new RF3T system - the company's highest productivity, lowest cost-of-ownership (CoO) coat/develop track system targeted for the full range of lithography applications. This system significantly extends the capabilities of SOKUDO's established RF3 platform to achieve world-class 200 wafer per hour (wph) throughput, keeping pace with the fastest lithography scanners while maintaining process transparency. 

Problem: Lithography track systems are required to meet both the process performance requirements from demanding immersion lithography applications while matching the throughput and cycle-time requirements. Increased defectivity requirements coupled to additional process steps within the track require continued development of track systems.

Solution: To achieve a 10 percent throughput improvement over the RF3S, the RF3T system features additional parallel process modules and higher efficiency wafer transport. The develop cell has been reconfigured for eight develop modules in the same platform footprint to provide 60 percent higher develop and rinse process capability than the previous system. A novel wafer coating dispense system significantly reduces chemical
consumption, the largest contributor to track operating cost. When combined, these features provide lower CoO and higher process performance for lithography applications.

Applications: Immersion ArF <0.1 defects/cm2 by SDC Soak. ArF, KrF, i-line, BARC, SOG, Color filter, to name but a few. The system has an integrated OCD metrology option.

Platform: RF3T system is based on the production proven RF3 platform, which had over 200 systems installed in both 200 and 300mm wafer configurations.

Availability: December 2007 onwards.


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