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New Product: Rudolph reduces CoO for macro defect inspection with new AXi 940 module

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RudolphProduct Briefing Outline: Rudolph Technologies has made available the AXi 940 macro defect inspection module. The new AXi 940 module will perform wafer frontside inspection as part of the all-surface ‘Explorer’ Inspection Cluster - a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership. The first Explorer Inspection Cluster featuring an AXi 940 module is currently at a beta customer, and a second unit is scheduled to ship in April 2008. The initial systems are targeted primarily for high-volume production applications in advanced lithography and CMP processes. 

Problem: The AXi 940’s software is claimed to significantly reduce the amount of time required for recipe creation by automating many of the tasks and decisions that are normally done by the tool operator. In addition, the all-surface Explorer Inspection Cluster gives users the ability to take the AXi 940 module offline for recipe creation while keeping all other modules in the cluster in production. Previously, if one module had to be worked on, the entire tool would have to be taken off-line.

Solution: The AXi 940 is the culmination of over three years of software development and incorporates the technological developments found in the AXi and Waferview product lines. This convergence of technology has resulted in improved macro resolution paired with a completely redesigned software interface focused on reducing cost-of-ownership through improved productivity and reliability, as well as reduced dependence on human operators.

Applications: Macro defect inspection including CMP and lithography.

Platform: The AXi series features a flexible and modular platform which enables future upgrades for all-surface inspection.  Bridge tool capability facilitates inspection of 200-300mm wafers. It has multiple inspection resolution flexibility with typical throughputs between 120-140 wph and can detect defects as small as 0.5 microns.

Availability: January 2008 onwards.


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