Online information source for semiconductor professionals

New Product: Rohm and Haas‚?? groove designs for CMP pads reduces cost of consumables

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Rohm and Haas’ groove designs for CMP pads reduces cost of consumablesProduct Briefing Outline: Rohm and Haas Electronic Materials have said that its novel defect reduction and slurry reduction groove designs for CMP pads have already been adopted in high volume manufacturing (HVM) by customers in Europe, Korea, North America and Taiwan. While currently being used on the Rohm and Haas IC1000 AT CMP pad for the 90nm process node and below, multiple customers are now also testing the defect reduction groove on the ‘VisionPad’ line of CMP pads.

Problem: To meet highly complex planarization challenges, Rohm and Haas are currently testing a profile correction groove design, which addresses customer-specific process issues, but does not require them to modify their integration schemes. 

Solution: The slurry reduction groove design, based on specialized flow experiments and computational fluid modeling, is claimed to achieve greater than a 30 percent reduction in the cost of consumables in metals processes. This performance is made possible through improving slurry delivery to the leading edge of the wafer, improving utilization of slurry in pad-wafer gap, and reducing slurry flow rate requirement for a given removal rate.
The defect reduction groove design features an innovative constant area spiral pattern that is optimized for both wafer-scale and groove-scale mechanics. The design effectively removes localized pressure on the wafer, minimizing scratches and defects, and has demonstrated up to a 50 percent improvement in defectivity rates.

Applications: A variety of CMP applications at the 90nm node and below.

Platform: Rohm and Haas’s novel groove designs can be used on various VisionPad and IC1000 AT pad products, and can be customized based on customer requirements and existing consumable sets, or on desired process conditions.

Availability: September 2008 onwards.

Related articles

Rohm and Haas claims 20 percent reduction in tungsten CMP consumable costs - 23 April 2008

New Product: Rohm and Haas offers improved defect reduction with new CMP pads - 24 November 2006

Rohm and Haas‚??s Hsinchu facility receives first CMP pad volume order - 17 March 2009

Oki transfers 95% of semiconductor business to Rohm - 31 July 2008

IBM & Rohm and Haas sign JDA on copper/low-k CMP through 22nm node - 27 February 2008

Reader comments

If CMP pads producers can't deveop nano-grade CMP pads for semi-conductor industry, sooner or later, she'll be out of competition if there's producer of nano-grade PU CMP pads for semi-conductor industry. Rohm and Haas has been trying very hard to develop nano-grade PU CMP pads during past decade unsuccessfully. In the very near future, global semi-conductor industry should apply nano-grade PU CMP pads, especially for 18' chip production. Frankly speaking, it's very hard for Rohm and Haas to develop nano-grade PU CMP pads successfully.
By David C.K. Lo on 18 October 2009
Nothing special. Rohm And Haas sill can't develop nano-grade PU CMP pads. As far as I know, Rohm And Haas has been trying many years to develop a.m.
By David C.K. Lo on 26 September 2009

Post your comment

Please enter the word you see in the image below: