Online information source for semiconductor professionals

New Product: Oxford Instruments provides new integrated TEOS solution for SiO2 PECVD

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Oxford InstrumentsProduct Briefing Outline: Oxford Instruments has introduced its new TEOS delivery module for plasma-enhanced chemical vapour deposition (PECVD) of silicon dioxide (SiO2) in its ‘Plasmalab' range of deposition tools. TEOS offers an alternative PECVD precursor to the commonly-used silane for applications such as photonics and dielectric layers in which high quality, conformal deposition of SiO2 is required, according to the company.  The company has already received its first order for a complete PlasmalabSystem133 TEOS system incorporating the new module from a prestigious Chinese institute.

Problem: Though silane is commonly used in IC fabrication, special safety measures are required due to its flammability. Lowering costs while maintaining process yields and safety is required with new alternative systems.

Solution: The new TEOS delivery module is claimed to be easy to access and change, with an optional glovebox fitting onto the module for improved safety, and the ability to connect the module into a cleanroom extraction system. The module may be either directly mounted onto the PlasmalabSystem100 or PlasmalabSystem133 process tool, or wall-mounted, and features optimised heated delivery lines to ensure efficient, high-uniformity SiO2 PECVD processes. Combined with Oxford Instruments' high/low frequency plasma power mixing to control the stress of the deposited film and select between tensile, compressive and low-stress films, the new integrated TEOS system offers an improved SiO2 deposition solution.

Applications: (PECVD) of silicon dioxide (SiO2).

Platform: The new TEOS delivery module for plasma-enhanced chemical vapour deposition (PECVD) of silicon dioxide (SiO2) is designed for its ‘Plasmalab' System100 and ‘Plasmalab' System133 deposition tools.

Availability: January 2007 onwards.

Oxford Instruments

Related articles

Tool Order: Oxford Instruments wins multiple deals in Russia - 16 April 2008

Oxford Instruments to use ITRI facilities for process demonstrations - 08 February 2011

Tool Order: Oxford Instruments reports order from KAUST in Saudi Arabia - 16 April 2009

Tool Order: OIPT garners multiple orders from Malaysia - 03 March 2008

Oxford Instruments acquires HVPE equipment supplier - 10 April 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: