Product Briefing Outline: Nikon’s new S620D incorporates a multi-axial catadioptric lens with a 1.35 NA that will satisfy the imaging requirements to enable DP for 32nm and future technology generations. This lens design delivers extremely low aberrations and minimized local flare. In addition, the S620D design enables active aberration control, and enhances CD uniformity with dose and focus feedback and tuning capabilities that further increase yield. The S620D has already satisfied the aggressive CDU requirements for lines and spaces at 32nm, and demonstrated 22nm patterning capabilities, confirming extendibility to next generation applications.
Problem: Lithography requirements continue to accelerate, but technical challenges and infrastructure limitations will likely prevent IC manufacturers from adopting EUV lithography until 2014 or later. Therefore, it is necessary for today's immersion scanners to not only satisfy 32nm requirements, but also be extendible to 22nm applications. To successfully extend immersion lithography to 22nm, leading-edge scanners must provide an affordable lithography solution that delivers high production yields in a timely manner so chip makers can maximize profits.
Solution: The S620D has demonstrated excellent overlay performance, and achieved across-lot overlay data below 2 nm, as well as lot-to-lot stability data across three lots ≤ 2.2 nm (3σ)–fully satisfying 32 nm manufacturing requirements and approaching 22 nm targets. A key challenge for immersion double patterning is affordability, and S620D throughput is a critical factor in making DP cost effective for manufacturing. The S620D wafer stage uses increased scan speed and improved acceleration capabilities to decrease exposure time. In addition, the Stream Alignment wafer mapping system utilizes multiple alignment microscopes (Five-Eye FIA) and a wide area autofocus sensor (Straight Line Autofocus) that spans the wafer to dramatically reduce overhead time. Together, these innovations enable the Streamlign platform to target 200 wafers per hour, which reduces the cost of ownership and makes DP cost effective for manufacturing.
Applications: 32nm and below double-patterning.
Platform: The S620D incorporates the new Modular 2 Structure to streamline system installation and simplify maintenance. Additionally, to extend immersion to 22 nm, the newest scanners must also provide the optimal path to profitability for IC makers. S620D system reliability has been thoroughly demonstrated by processing >4000 wafers per day and executing 24 hour wafer cycling free of any tool errors or interrupts. The S620D modular design also supports multigenerational use of this platform, with individual modules able to be upgraded as necessary to enable scanner reuse at 22nm.
Availability: March 2011 onwards.