Online information source for semiconductor professionals
New Product: Mattsonâ??s Helios XP has low temp RTP capability enabling advanced silicide formation
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Product Briefing Outline: Mattson Technology has launched the Helios XP system, its third generation of 300mm RTP tools. The company noted that its Helios XP system has been in qualification at a major IC manufacturer and it recently shipped a system to a leading foundry customer for advanced anneal processing.
Problem: Helios XP is claimed to offer the industry's first RTP processing capabilities at temperatures down to 220 degrees Celsius and below, enabling the advancement of future technology node development including the formation of advanced silicides. In addition, temperature and ambient controls have progresses to enable within-wafer uniformity and wafer-to-wafer repeatability required for 45nm and below technology nodes.
Solution: The system features an advanced temperature control for increased within-wafer uniformity and wafer-to-wafer repeatability. Helios XP incorporates proprietary design features, including dual-sided wafer heating to improve device yield by reducing pattern-related temperature effect. Complete with superior ambient control and new process gas arrangement, Helios XP offers advanced thermal processing.
Applications: Helios XP offers the industry's most advanced low temperature thermal processing capability, as well as high temperature for spike anneal and wafer manufacturing thermal applications.
Platform: Built on a modular, dual-chamber platform designed for ease of maintenance and high reliability, the Helios platform includes a dual-arm robot for increased throughput (over 120 wafers per hour). The system also features a contactless guard ring that entirely surrounds the wafer to eliminate edge effects, thus providing 0 slip line generation during processing.
Availability: September 2009 onwards.