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Product Briefing Outline: Mallinckrodt Baker is making the BAKER CLk-870 residue remover available as a cost-effective wet clean product designed to remove inorganic residue and post-etch/ash polymer from 90nm single-wafer processes. According to Mallinckrodt Baker, BAKER CLk-870 residue remover provides fast cleaning action and low process temperatures, making it an ideal chemistry for silicon nitride, copper and delicate low-k substrates.
 
Problem: The global demand for chemistries that provide significant cost savings on mature technology platforms continues to increase as wafer fabrication facilities look to incorporate methods to reduce operational costs. BAKER CLk-870 residue remover is a 100 percent water-soluble formulation, so it does not require an intermediate solvent rinse. The elimination of the intermediate solvent rinse decreases total process time, thereby reducing operation costs.

Solution: With an etch rate of <1 Å per minute at 75°C for copper and deposited low-k , the BAKER CLk-870 residue remover is designed for use in single-wafer processors, spray tools or bath systems, and boasts a bath life that is typically greater than 24 hours. Designed to provide broad latitude in terms of processing time and temperature, the residue remover achieves normal process times of 30 seconds for single-wafer tools and 10 minutes for spray and bath treatment at typical process temperatures of 45°C-75°C.

Applications: Silicon nitride, copper and delicate low-k substrates.

Platform: Designed for use in both an open spray tool or bath system.

Availability: December 2006 onwards.