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Product Briefing Outline: KLA-Tencor has introduced the ‘Surfscan SP2XP,’ with improved sensitivity to defects on silicon, poly and metal films and enhanced ability to sort defects by type and size, compared with its predecessor, the Surfscan SP2.  It also features vacuum handling and higher throughput. These capabilities are designed to enable chipmakers to bring their leading-edge (≥4Xnm) devices to market faster by delivering improved process tool monitoring throughout the fab. The new system also introduces an ultra-high sensitivity operating mode to accelerate fabs’ development of 3Xnm and 2Xnm next-generation devices.

Problem: With continued need to improve defect levels on bare wafers of all types to prevent yield loss in chip manufacturing wafer manufacturers have need better inspection tools to enable and re-work of polished wafers to improve yield loss. The Surfscan SP2XP system addresses the need to quickly flag process tools which are generating excessive defectivity, so that the problem can be corrected with minimal wafer scrap, yield loss and market delay. Advancements in sensitivity and throughput have been made, as well as by introducing the capability to distinguish particles from micro-scratches and residues without the need to expend resources on SEM review.

Solution: Opto-mechanical and signal processing improvements are designed to ensure capture of even the smallest defects on bare wafers, as well as front-end and back-end films. Patented multi-channel architecture and innovative algorithms enable the Surfscan SP2XP system to automatically differentiate defect types. The tool also delivers improved throughput to that of the previous-generation Surfscan SP2, enabling fabs to inspect more wafers per hour or to use a higher sensitivity setting without loss of throughput.

Applications: All types of bare wafers, including prime wafers, SOI (silicon-on-insulator), epitaxial and engineered substrates.

Platform: Up to 36 percent throughput boost results from a combination of changes in opto-mechanics, electronics and software. An opto-mechanical innovation enhances the tool’s sensitivity to defects on rough films such as polysilicon, tungsten and copper. A new differential interference contrast (DIC) channel, enables capture of shallow, flat and faint defects-of-interest such as residues or bumps.

Availability: September 2008 onwards.