Online information source for semiconductor professionals

New Product: KLA-Tencor boost productivity on optical CD metrology system

08 February 2006 | By Mark Osborne | Product Briefings > Lithography

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

KLA Product Briefing Outline: KLA-Tencor has launched its latest-generation optical CD metrology system, the SpectraCD-XT, which provides inline CD and profile measurements of critical device structures that help enable early prediction of IC performance and yield at the 90-nm and 65-nm nodes. The only high-performance spectroscopic ellipsometry (SE)-based CD metrology tool with sub-two-second move-acquire-measure (MAM) time, SpectraCD-XT provides a two-fold increase in throughput (to more than 100 wph) compared to the previous-generation platform at comparable performance, according to the company.

Problem: Chipmakers face shrinking process windows and tighter process tolerances as they scale to smaller design rules. As a result, minute lithography process variations can significantly impact device performance and functional yields. This drives the need for increased measurement sampling early in the manufacturing cycle with minimal impact to fab productivity. In addition to requiring standard CD linewidth information, increasing hidden systematic errors in lithography today mandate the need for 3D profile information on device structures, including sidewall angle, and top and bottom CD, to obtain yield-relevant data that provides better correlation to back-end-of-line (BEOL) device performance tests.

Solution: SpectraCD-XT with SE technology offers leading precision on advanced applications where device structures are highly complex and require multiple types of measurements, such as shallow trench isolation (STI), gate and spacer. Unlike reflectometry-based metrology systems, which provide near-normal incidence (top-down) illumination, KLA-Tencor's SE optics uses oblique illumination to enable the identification of smaller structural anomalies-such as notching and footing of gate profiles-that more accurately correlate to end-of-line device performance and yield. Emerging optical CD metrology applications include:  contact holes; BEOL trenches and vias; and scanner qualification, where the SpectraCD-XT's sub-two-second MAM time makes it an ideal solution for measuring the tens of thousands of points per wafer
needed to characterize cross-field and cross-wafer CD uniformity.

As CD process control budgets shrink, tool matching has become increasingly critical for device manufacturability. The SpectraCD-XT offers excellent matching performance, both tool-to-tool and with KLA-Tencor's integrated CD module, enabling chipmakers to implement a comprehensive fab-wide CD control strategy. Improved model setup and analysis tools embedded on the SpectraCD-XT speeds library generation by 30 to 60x-providing significant savings in time and engineering resources, which in turn, help enable faster yield learning on new technologies. The system is also built on a platform with proven reliability in high-volume production.


Applications: Shallow trench isolation (STI), gate and spacer.

Platform: The system is built on a platform with proven reliability in high-volume production. Improved model setup and analysis tools embedded on the SpectraCD-XT speeds library generation by 30 to 60x.

Availability: February 2006 onwards

Related articles

Tool Order: Nova gains two new customers in Asia - 14 September 2010

Tool Order: Nova notes 5 new customers and 7 separate multiple metrology installs - 08 July 2010

‚??SpectraShape‚?? metrology tool from KLA-Tencor and TEL enables characterization of complex struct - 30 March 2011

Tool order: Nova gains new DRAM customer for standalone optical CD metrology systems - 14 June 2010

Nova‚??s 3090Next CD metrology system integrated into Sokudo‚??s RF3 track system - 27 February 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: