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New Product: GAMMA Express dry strip system from Novellus tackles sub 65nm resist removal

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GammaProduct Briefing Outline: Novellus Systems has launched its newest line of ‘GAMMA Express' dry photoresist dry strip high dose implant strip (HDIS) systems for 300mm wafer processing. A single product platform for both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications, GAMMA Express is claimed to provide the highest levels of technology, reliability and productivity for bulk strip and HDIS at the 65nm and 45nm nodes. The system is currently in beta evaluation with a large memory manufacturer in Asia, according to the company.

Problem:
New materials and processes required for advanced node IC devices put increasing pressure on dry strip technology to offer no-plasma induced damage. Importantly, post-strip residue needs to be minimal to prevent the use of complex wet clean steps. With HDIS it is important to limit resist flaking or have implant or sputtered oxide residue. Temperature control is also crucial to prevent resist popping at elevated temperatures.

Solution: The system includes low silicon loss implant strip and non-oxidizing strip chemistries for compatibility with advanced Silicide and ultra low-k films, in addition to support for conventional bulk strip, HDIS, and C4 packaging applications. This application diversity is enabled by five active RF stations and a tailored Universal Gas Distribution system. Single digit particle performance with all minimum contact area (MCA) components, including load locks with MCA cassette, ceramic MCA blades, spindle with MCA fingers, and process, over-ash and preheat pedestals, help customers repeatedly achieve lower defectivity, according to the company.

Applications: Bulk strip and high dose implant strip (HDIS) at the 65nm and 45nm nodes.

Platform: High composite productivity, with more than 300 wph for bulk strip and 150 wph for HDIS, is driven by a new proprietary source technology combined with Novellus' Multi-Station Sequential Processing (MSSP) architecture. High system availability - with short mean time off line (MTOL) and high mean time between failures (MTBF) - enabled by state-of-the-art direct drive wafer handling, a new open frame architecture for easier serviceability, are additional features claimed by the company.

Availability: July 2006 onwards.

 

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