Online information source for semiconductor professionals

New Product: EtchTemp SensorWafer from KLA-Tencor can characterize high-power, high-frequency etch

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Product Briefing Outline: KLA-Tencor has introduced the next-generation in-situ plasma etch wafer temperature measurement product, the ‘EtchTemp SensorWafer.’ The newest SensorWafer from KLA-Tencor’s SensArray division captures the effect of the process environment on production wafers and offers new capabilities to robustly characterize the high-power, high-frequency etch recipes proliferating at 65nm nodes and below. The EtchTemp SensorWafer enables etch engineers to further visualize, diagnose, and control their processes and process tools, through the significantly increased process measurement capabilities.

Problem: One of the key challenges for etch engineers today is matching chambers to achieve consistent performance across the entire toolset. Additionally, smaller processing windows make chamber matching difficult, and higher RF power recipes make it harder to achieve Cpk (process capability) goals.

Solution: The EtchTemp SensorWafer has new enhancements that include up to 7kW total radio frequency (RF) power and RF immunity for use in any reactor. It also has the ability to collect data without modification of process recipe or tool/robot settings. The enhanced spatial resolution comes with 32 sensors within 10mm of the wafer edge, offering 60% increased radial coverage. With EtchTemp’s highly accurate measurement of plasma etch temperatures, engineers will have access to previously unavailable data, gaining information on the dynamic response to diverse recipe steps as well as chamber-to-chamber variations. The data captured by the EtchTemp can also be used by equipment engineers to qualify tools and ensure chamber health.

Applications: The EtchTemp SensorWafer, supported by the PlasmaSuite Software package, is designed specifically for chamber matching, post-PM qualification, trouble-shooting and process development.

Platform: The PlasmaSuite Software package, is designed specifically for chamber matching, post-PM qualification, trouble-shooting and process development. Key features for these applications include advanced RF shielding, enabling accurate temperature measurement at high RF powers as well as all frequencies and reactor designs; 65 temperature sensors allowing increased wafer edge resolution; all electronics totally encased within silicon substrates, enabling thin 1.2mm profile resolves tool clearance issues; and advanced manufacturing processes bringing increased reliability and durability.

Availability: April 2009 onwards.

Related articles

In-line electrical metrology for high-k gate dielectrics deposited by atomic layer chemical vapour d - 01 September 2002

New Product: AE‚??s Paramount RF-power delivery system has network analyzer type accuracy - 05 July 2007

Improving Processes Through RF Power Control - 01 March 2000

Order Focus: IQE to supply GaN wafers to TriQuint - 27 January 2011

Power hungry FPGAs get fix at 90nm - 04 February 2005

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: