Product Briefing Outline:
Eco-Snow's advanced, automated MaskClean 150 System is a dry CO2 alternative to conventional cleaning methods for removing particulate and light organic contamination from the surface of photomask substrates. The system is helping a major U.S. photomask manufacturer save money and improve the quality of its photomasks and reticles with a cleaning technology designed for the 28nm DRAM half-pitch technology node. The system reclaims masks by removing contaminants left behind by wet cleaning; preserves mask quality by reducing the number of erosive wet cleaning cycles required and reduces the cycle time required to create masks, since fewer cleanings are needed.
Because even one small particle left during the manufacturing process can ruin a photomask, manufacturers require precise cleaning to ensure zero print defects on the integrated circuits the masks and reticles are used to produce.
The system's innovative CO2 precision surface processing technology offers numerous advantages: no drying time, low consumables cost, substrate temperature control, variable process definition, a small footprint, and eliminates the use and disposal of hazardous materials. The technology therefore allows manufacturers to start fewer masks in order to ensure a completed photomask or reticle meets specification.
Photomask substrate cleaning.
The MaskClean 150 system also accepts masks in SMIF pods, making it compatible with current generation mask production tool sets and extends usability to at least 2014. Eco-Snow Systems, an affiliate of The Linde Group, is a leading supplier of automated, carbon dioxide (CO2)-based cleaning tools and processes to the semiconductor industry.
January 2009 onwards.