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New Product: E25 from Rudolph automates defect classification at the bevel-edge
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Product Briefing Outline: Rudolph Technologies, has
launched the ‘E25' Wafer Edge Inspection System, a second generation
replacement for August Technology's E20 System and the latest addition
to its suite of "all-surface" inspection tools.
Problem: Edge inspection has become critical in advanced semiconductor manufacturing operations--edge defects currently account for as much as 30% of all killer defects and their detection and control is critical to improving and maintaining process yields. Films can wrap around the edge and accumulate in layers that eventually flake off, only to be redeposited on the frontside of the wafer. Traditional SEM tools could not correctly view the bevel-edge yet fab engineers had become increasingly aware that defects in this region of the wafer were responsibe for defects being captured in later surface inspection steps.
Solution: Unlike laser-based edge inspection technology, which detects only the amount of light scattered by a defect and thus requires further optical review for defect identification, the E25 image-based inspection uses multiple color cameras, concurrent color image capture and intrinsic ADC (automatic defect classification) to quickly detect and classify a wide range of defects based on size, morphology, color, location and other unique characteristics. In most cases the E25 data alone are sufficient for rapid root cause identification, eliminating the need for additional optical review. The E25 incorporates numerous software and optical enhancements including brighter illumination, greater defect capture rate and simplified recipe creation. It features an improved algorithm to create a defect-free surface model of the edge and uses this model to detect and classify defects.
Applications: edge and front-side inspection throughout the entire manufacturing process - front-end to back-end.
Platform: In its current configuration, the E25 System integrates with the company's AXi or NSX Inspection Systems.
Availability: March 2006 onwards.