Online information source for semiconductor professionals

New Product: Dual polishing action enables Applied‚??s Reflexion GT CMP system higher productivity

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Product Briefing Outline: Applied Materials has launched the ‘Reflexion GT’ system for advanced metal CMP applications.  The system’s novel dual wafer design is claimed to set new benchmarks in CMP performance and productivity, delivering superior profile control and 60% higher throughput than competing systems. The Reflexion GT also dramatically cuts consumables cost, requiring up to 30% less slurry and processing twice as many wafers per polishing pad.

Problem: Today’s copper-based logic and memory devices have more copper interconnect layers, requiring faster CMP processing and more efficient use of consumables.

Solution: Key to the Reflexion GT system’s benchmark performance is its dual mode architecture, enabling two wafers to be processed simultaneously on each platen using independently-controlled ‘Titan Contour’ polishing heads. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system’s advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied’s production-proven Desica technology with Marangoni vapor drying for fast, effective, watermark-free drying.

Applications: The Reflexion GT system is available for 4xnm copper interconnect planarization and has demonstrated extendibility to tungsten applications.

Platform: Unique dual wafer architecture is used, simultaneously processing 300mm wafers in pairs. Dedicated slurry delivery and pad conditioning for each wafer promotes matched process conditions.

Availability: December 2009 onwards.

Related articles

Applied Materials ‚?? Reflexion GTTM‚?? CMP system tackles tungsten films at lowest cost - 16 June 2011

New Product: Applied Materials adds ‚??FullVision‚?? real-time control to CMP platform - 29 November 2007

New Product: Dow’s new copper polishing pad offers reduced chatter and micro-scratch defectivity - 01 October 2009

Milestone: Applied Materials ships 2,500th CMP System - 04 April 2008

New Product: Axcelis‚?? Imax high dose, low energy boron cluster implant technology added to Optima - 21 August 2006

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: