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New Product: Dow’s new copper polishing pad offers reduced chatter and micro-scratch defectivity

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Product Briefing Outline: Dow Electronic Materials has introduced the Optivision 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over the pad lifetime. The new pad is formulated with a unique, surfactant-free, polymer chemistry and pore structure to help minimize defectivity and provide higher dielectric film rates in copper barrier polishing. The pad has a dual pore structure that accurately controls polishing while providing a consistent polishing surface over the life of the pad.

Problem: There is a continued requirement for a higher throughput, lower defect pad, specifically in copper barrier polishing. Key improvements required are in chatter and microscratch defectivity.

Solution: Optivision 4540 pad has demonstrated an order of magnitude improvement in chatter and micro-scratch defectivity compared to ‘Politex’ pad products, resulting in higher production yields. Tests by the compnay have shown a 40% increase in TEOS removal rate compared to Politex pads, resulting in higher throughput and reduced CoO, according to the company. Also the Optivision 4540 pads stability is said to extend beyond 1,000 wafers.

Applications: Copper barrier polishing.

Platform: The pad can also be used in conjunction with Dow’s ACuPLANET 5100 Series Slurries for enhanced performance. The new pads are available in multiple sizes and configurations, including the latest window options, for current and emerging technology nodes and platforms.

Availability: Dow is currently sampling the pads and will be commercially available in Q4, 2009.

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