Product Briefing Outline:
At the 2011, SPIE Advanced Lithography Conference, Cymer has announced the development of new focus drilling technology for its immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300. According to Cymer, focus drilling provides up to a 2X improvement in the depth of focus on the wafer, thereby enabling a larger process window that can positively impact chipmakers' yield.
Laser focus drilling technology was developed to aid chipmakers in patterning deep contact and via structures with thick resists where high depth of focus is required.
Cymer's focus drilling solution is supported by a technique involving operation of the light source at multiple bandwidths utilizing metrology that was designed to measure high-bandwidth spectra. Additionally, the unique spectral shape of Cymer's light sources can improve depth of focus with minimal impact on other key process parameters.
Immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300.
Light sources equipped with focus drilling are being qualified, and are currently under chipmaker evaluation.