Online information source for semiconductor professionals

New Product: Crossing Automation‚??s ‚??ExpressSolutions‚?? offers OEM’s wafer-level automation

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Product Briefing Outline: ExpressSolutions starts by identifying and understanding a customer’s requirements for a specific process and ends with the implementation of an optimized wafer transfer system. By using Crossing’s modular ‘ExpressConnect’ automation solutions, ExpressSolutions delivers custom configurations that reduce overall cost and time-to-market while maintaining OEM differentiation at the process level. As part of the offering, ExpressSolutions facilitates the design, system integration and documentation of a complete wafer automation platform and its ongoing support. This allows customers to leverage internal engineering resources and achieve reduced acquisition costs, reduced inventory build-up and benefit from low platform support costs.

Problem: Ensuring that wafer flow (delivering a wafer to the right place at the right time, in the most effective manner) is optimized such that that the process module is operating at maximum efficiency. Being able to do this within certain cost parameters as well as offer OEMs flexibility in automation design (inline, non-inline), allowing them to differentiate at the process solution level.

Solution: ExpressSolutions follows the launch of ExpressConnect in January 2009. Where ExpressConnect delivers the hardware and software required for optimized wafer-level automation, ExpressSolutions provides OEMs with outsourced wafer-level automation expertise to design and deliver optimized wafer-level automation configurations based on standard modular products. This provides OEMs with solutions achieving a 20 to 70 percent smaller footprint; greater flexibility; lower cost; higher productivity; and throughput up to 250 wafers per hour. ExpressSolutions delivers fully supported automation solutions tailored to each customer’s specific requirement targets and achieves significantly reduced costs by implementing standard modules from the ExpressConnect product range.

Applications: Integrated vacuum wafer handling systems for vacuum process tools, including etch, CVD, clean, RTP and Metrology.

Platform: ExpressSolutions is an optimized wafer transfer platform solution focused on two primary service areas: system integration engineering and custom design engineering. Customers can use Crossing’s system integration engineering to obtain a complete ExpressConnect system design, documentation package and sustaining engineering service along with custom engineered specials (CES) support including design, documentation and on-going support.  With Crossing’s custom design engineering services, customers have the ability to add their own proprietary content to the standard ExpressConnect modules to create fully customized platform solutions, along with a documentation package and sustaining engineering and CES support. ExpressSolutions may also be extended to design customer owned modules that can be integrated with ExpressConnect.

Availability: May 2009


Related articles

Tool Order: Crossing Automation enters carbon nano-tube market with design win - 14 December 2010

New Product: Crossing Automation takes vacuum wafer handling to next level of standardization - 13 March 2009

New Product: Crossing Automation enhances Spartan EFEM with 450 wafers per hour (wph) throughput - 26 March 2010

Asyst software and hardware sell-off completed - 02 September 2009

Financial details disclosed of Asyst Technologies asset sale - 05 August 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: