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New Product: Cost sensitive thin film metrology systems from Rudolph Technologies
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Product Briefing Outline: Rudolph Technologies, has
launched both the ‘S3000' and ‘S2000' ellipsometry-based metrology
systems designed to provide high throughput, cost-effective
measurements of thin transparent films in volume production
environments.
Problem: Rudolph-proprietary geometric pattern-matching technology provides improved robustness for patterned wafer applications in the etch and CMP modules with low image contrast or a large degree of color variation. For additional cost savings, optional integrated stress/bow measurements eliminate the need for a separate instrument.
Solution: The S3000/2000 systems use Rudolph's fifth-generation FOCUS beam ellipsometry, incorporating long-life laser light sources for high accuracy, long-term stability, small spot size and easy tool-to-tool matching. The systems also provide optional deep UV and visible reflectometry capabilities to flexibly address a broad range of applications throughout the fab.
Applications: Transparent film metrology in the thin film, CMP, etch and lithography
Platform: Built on Rudolph's ‘Vanguard' platform, the S3000/2000 incorporates Microsoft Windows XP based interface.
Availability: June 2006 onwards.