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New Product: Bosch Rexroth‚??s wafer lift subassembly simplifies integration

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Bosch Rexroth’s wafer lift subassemblyProduct Briefing Outline: Bosch Rexroth has developed a semiconductor wafer lift subassembly ready to install as a single component, helping tool builders lower costs, streamline their supply chain, and reduce engineering expenses. The lift subassembly has a stroke of 2.25 inches and a duty cycle time of one cycle per second. It carries a load of 12 pounds and is also exposed to a vacuum load of 108 pounds.

Problem: Semiconductor equipment manufacturers are constantly trying to find ways to lower costs, increase efficiency, and improve productivity for each new generation of equipment. As tool builders seek ways to find competitive advantages, they are starting to outsource their automation needs to suppliers who can design and build subassemblies more efficiently, allowing OEMs to focus on their core competencies.

Solution: Not only does the wafer lift subassembly come tested and ready to install as a single component, it provides smooth, vibration-free motion and is rated for more than seven million cycles. To achieve optimum smoothness, Rexroth engineers calculated the proper balance of preload on the ball screw and alignment of the parts to achieve the ideal level of stiffness.

Applications: Wide spectrum of semiconductor equipment.

Platform: Rexroth’s electromechanical solution, developed to help toolmakers simplify their automation requirements, uses size 15 Ball Rail® with a precision Rexroth 12mm diameter ball screw in the T5 accuracy class. The company’s compact servo drive, mounted remotely on the tool, controls a 100-watt Rexroth maintenance-free servo motor that powers the lift.

Availability: Currently available.

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