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Product Briefing Outline: Aviza Technology has launched the Versalis fxP, a 200/300mm cluster system targeted for 3D-IC manufacturing using through silicon via (TSV) technology. The Versalis fxP is based on Aviza’s single-wafer platform, which can incorporate up to six process modules such as deep silicon etch, PVD and CVD. The platform is designed to combine the critical processes needed to create a via ready for plating.

Problem: Three key elements are driving the design of advanced consumer products, increased functionality, reduced size and lower cost. These are the very same drivers that are pushing the adoption of 3D-ICs and the associated required packaging technologies. The two most common technologies for 3D-IC packaging are wire bonding and TSV to establish the electrical connectivity between the components of the stacked die. An increasingly important factor in favor of TSV is that it can consume up to 30 percent less silicon than the wire-bonded equivalent, because wire bonding can only connect around the periphery of the device. Recently, the raw cost of silicon has risen over 10x fueled by solar cell demand, significantly changing the cost comparison picture between TSV and wire bonding. Furthermore, this requirement for additional silicon to satisfy wire-bonders means that less die can be manufactured on the source wafer, putting additional pressure on profit margins.

Solution: With all three process technologies (etch, PVD and CVD) on board, the Versalis fxP offers a much smaller footprint, compared to three individual systems, and a single install minimizing cost and disruption to the cleanroom, thus reducing the overall development and processing time to deliver the first wafer out. In addition, this type of system allows R&D users to link separate processes without breaking vacuum to discover potential performance benefits, and then apply those findings to optimally configure production systems, which would not be possible on traditionally-configured single-process systems. For full volume production capability, the individual process modules would be installed onto additional handlers, each one dedicated to each of the separate processes—a feature offered by the Versalis fxP system. This approach can only be realized if the process modules all shared common mechanical interface and control systems. This leads to minimal process re-qualification, an additional advantage for adopting an integrated hardware and process approach for TSV-based 3D packaging.

Applications: 3D-ICs using TSV technology have numerous applications, including NAND flash memory, image sensors, sensors and DSP, DRAM, SRAM, FPGA and memory, processors, amplifiers for wireless LAN, communication for mobile phones and military applications.

Platform: Aviza’s Versalis fxP system is a single wafer 200/300mm cluster system that integrates multiple processes (including etch, PVD and CVD) on one platform.  

Availability: June 2008 onwards.