Product Briefing Outline: ATMI has introduced a new
product line for 300mm wafer reclaim applications called ‘RegenSi Wafer
Reclaim Solutions.' ATMI's formulas are designed for dielectric removal
and are semi-aqueous, fluoride-based solutions with low viscosity, and
are therefore easily rinsed with water. They are designed to work with
either batch or single wafer spray tools.
Problem: The increasing use of 300mm wafers has
accelerated the need for a cost effective method of efficiently
reclaiming test wafers and reworking product wafers.
ATMI claims
that its new etching formulas can reduce wafer reclaim processing costs
by as much as 30 percent, which could generate savings of several
million U.S. dollars per year and reduce the required level of test
wafers.
Solution: ATMI's RegenSi product line
is primarily focused on the dielectric removal process, and offers a
number of very important benefits. The composition of these products as
semi-aqueous, fluoride-based solutions with low viscosity means that
they are responsive to rinsing with water. While some wafer reclaim
processes rely on etching the dielectric through undercut and liftoff,
ATMI's formulations use dissolution as the physical means of dielectric
removal, which typically results in a shorter etch processing time.
ATMI's RegenSi Wafer Reclaim Solutions products produce a highly
selective dielectric etch, which does not result in significant pitting
or roughening of the Si wafer substrate surface, thereby potentially
eliminating or reducing the need for wafer surface planarization
following the dielectric etch.
Applications: Wafer Reclaim, TEOS, OSG: Coral™, Black Diamond™,
Aurora™, FSG, SiN, TiN, TaN Metals: Cu, Al, Ta, Ti. Also backside and bevel edge cleaning and product wafer rework.
Platform:
The products are recommended for use in either batch or single wafer
spray applications. Brush scrubbing is not recommended with this
product. RegenSi 31 is the baseline wafer reclaim product. ATMI also
offers a variety of specialized products tuned to various customer
needs. The selection of the optimum product is determined by the type
of dielectric to be etched, and by the operating parameters that are
most desired for the etch requirements. Available in 1 gallon, 5
gallon, and 55 gallon containers.
Availability: March 2007 onwards.