Online information source for semiconductor professionals

New Product: Applied Materials PVD ‚??Extensa‚?? provides copper deposition for memory devices

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

first PVD chamber to feature a flux-shaping, dual-magnet sourceProduct Briefing Outline: Applied Materials has launched its Applied Endura ‘Extensa’ PVD system, designed for depositing the critical barrier films for copper interconnects in sub-55nm memory chips. The Extensa system’s unique titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with benchmark step coverage and <3% film thickness non-uniformity across the wafer, while achieving best-in-class defectivity and >25% lower CoC2 than competing systems.

Problem: The introduction of copper in memory devices presents unique film integration challenges due to the high voltages and dense packing requirements of memory cells. Manufacturers are adopting new liner/barrier schemes as the most cost-effective way to get the performance benefits of copper.

Solution: The Extensa system enables the robust integration of these critical new diffusion barriers with a proven, single-system solution that allows memory makers to realize high device yields down to the 32nm technology node and beyond. Innovations in PVD technology are said to be implemented on the Extensa Ti/TiN deposition chamber. A novel dual-magnet PVD source with flux-shaping side electromagnets enables unmatched step coverage and defectivity below 10 particles at ≥0.12 micrometer. The proprietary source technology also makes more efficient use of deposition material, delivering a 30% improvement in target life. In addition, the single piece chamber kit features Applied’s proprietary ‘CleanCoat’ technology for ease of maintenance and particle control.

Applications: The Extensa technology offers Ti/TiN deposition solutions to support two key technology transitions in memory: the replacement of tantalum with Ti-based dielectric barriers in copper barrier/seed applications, and the introduction of copper-aluminum and copper-tungsten diffusion barriers that enable the most cost effective integration of copper with aluminum layers and tungsten vias.

Platform: Applied claims that this is the first PVD chamber to feature a flux-shaping, dual-magnet source, Extensa TTN’s high-ionization magnet improves step coverage for advanced features (>40% for 0.10μm 4:1 aspect ratio), with low center-edge bottom and sidewall asymmetry (~1:1). Side electro-magnets enable process tuning flexibility to accommodate different types of features and to compensate for etch-related variations in feature size.

Availability: Currently available.

Applied Endura ‘Extensa’ PVD system, designed for depositing the critical barrier films for copper interconnects in sub-55nm memory chips.

Related articles

Applied Materials plans equipment market dominance with Semitool takeover - 17 November 2009

Milestone: Applied Materials ships 2,500th CMP System - 04 April 2008

New Product: Applied Materials upgrades Endura CuBS PVD system for 32-22nm deposition - 02 June 2009

Emerging materials in semiconductors - 01 March 2008

Copper Metallization Technology for ULSI Chip Interconnects - 01 March 1999

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: