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New Product: ‘ACuPLANE’ copper barrier CMP solution from Rohm and Haas targets reduced defectivi
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Product Briefing Outline: Rohm and Haas Electronic Materials have introduced the ‘ACuPLANE’ Copper (Cu) Barrier CMP Solution for advanced Cu/low-k interconnect applications. The ACuPLANE system combines Rohm and Haas’s ‘EcoVision’ 4000 CMP Pad and ACuPLANE 5000 Series slurries to deliver a tunable CMP system that meets the stringent requirements of advanced process nodes.
Problem: By optimizing the performance of the pad and slurry combination, the ACuPLANE system is claimed to achieve an order of magnitude in defectivity reduction, while giving engineers higher levels of control to minimize metal and dielectric loss. Additionally, the ACuPLANE system can significantly minimize post-polish topography across the wafer, and reduce stress on the wafer to avoid dishing, erosion and delamination of porous ultra low-k films.
Solution: The EcoVision 4000 pad’s novel design increases the point contact area on the wafer surface which directly reduces stress on the underlying film stack. This results in defect reduction and improved die yields by minimizing scratches, chatter marks, and film delamination across the wafer. The ACuPLANE 5000 Series slurry is designed to give users flexibility and control over removal rates and selectivities to address specific process requirements. The slurry can be implemented in either a non-selective or selective approach to maintain or correct the incoming topography to enable superior topography performance post-barrier CMP process. In testing, the company said that customers are achieving two to three times the average pad life with a clear potential for higher throughput.
Applications: Copper (Cu) Barrier CMP for Cu/low-k interconnect applications.
Platform: The ACuPLANE Cu Barrier CMP system (comprised of a pad-slurry-pad conditioner solution) is available now in production volumes. It is currently in high volume manufacturing (HVM), testing and qualification at multiple 300 mm facilities worldwide.
Availability: September 2008 onwards.
