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Product Briefing Outline: Novellus Systems has developed a new suite of ashable hardmask (AHM) films that are claimed to have up to 25% greater etch selectivity compared to similar amorphous carbon films in use by the industry today. According to Novellus the highly selective and transparent (HST) AHM family of films has demonstrated die yield improvements as much as 7% when coupled with Novellus’ patented integrated edge bevel removal (EBR) technology. Read more >>

Product Briefing Outline: InnerSense LTD (a Ricor company) now offers a new wafer handling analysis product, the SMW2, for automated mechanical monitoring of the 300mm semiconductor process tools. The new product offering is based on over 6 years of experience in preventing excursions related to wafers’ micro-cracks and other mechanical defects, as well as providing capabilities to detect worn-out process tool mechanical components and to plan more effective periodic maintenance. Read more >>

Product Briefing Outline: Novellus Systems has launched the SABRE Excel, an advanced copper electroplating system designed to provide fill and defect density performance for the 22nm node and beyond. The platform features a new deposition module incorporating Novellus’ patented IRISCell technology, as well as new hardware, software and communications upgrades to the process tool’s mainframe. Additionally, an advanced plating process has been developed for SABRE Excel to take advantage of these new features. Read more >>

Product Briefing Outline: KLA-Tencor has extended its product offerings in the CMOS image sensor (CIS) market by announcing the 8900 defect inspection system. The system offers selectable illumination wavelengths, color-matched to CIS pixels; simultaneous brightfield and darkfield optical channels to enable capture of a wide variety of defect types; and adjustable sensitivity and throughput settings for cost-effective defect management from initial product development through volume production of color filter arrays (CFA). An 8900 defect inspection system was recently installed at the first 300mm advanced CFA fab of Toppan Printing. Read more >>

Product Briefing Outline: Dow Electronic Materials has introduced the Optivision 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over the pad lifetime. The new pad is formulated with a unique, surfactant-free, polymer chemistry and pore structure to help minimize defectivity and provide higher dielectric film rates in copper barrier polishing. The pad has a dual pore structure that accurately controls polishing while providing a consistent polishing surface over the life of the pad. Read more >>

Product Briefing Outline: Novellus Systems has developed a multiple wavelength UV Thermal Processing (UVTP) treatment on the company’s ‘SOLA’ platform that results in a claimed 25% improvement in film hardness compared to a single wavelength treatment of the same k-value dielectric. It also enables the independent optimization of key UV treatment steps to enhance film performance while maintaining a high level of manufacturability. Read more >>

Product Briefing Outline: Mattson Technology has launched the Helios XP system, its third generation of 300mm RTP tools. The company noted that its Helios XP system has been in qualification at a major IC manufacturer and it recently shipped a system to a leading foundry customer for advanced anneal processing.  Read more >>

Product Briefing Outline: Applied Materials has introduced the ‘Applied SmartMove’ system that enables a comprehensive wafer management solution for non-automated 200mm and 300mm fabs. The SmartMove system brings new efficiency to these fabs, seamlessly integrating with customers’ existing MES software to wirelessly track and direct the movement of wafer lots. Applied Materials claims the system can boost factory output by up to 10%, and typically realize a return on the investment in less than 9 months. Read more >>

Product Briefing Outline: Novellus Systems has developed an advanced Hollow Cathode Magnetron (HCM) ‘IONX’ PVD copper seed process that will enable copper interconnects below the 2xnm technology node. The breakthrough will allow the company’s highly-productive and proven HCM PVD technology on the ‘INOVA’ platform to continue to be used for barrier and seed thin film deposition, avoiding the migration to less-productive and costly ALD or CVD approaches. Read more >>

Product Briefing Outline: Luminescent Technologies, has broadened its product portfolio by adding what it claims to be the industry’s first offline computational mask inspection product. A premier company in Asia is the first customer to qualify the new computational defect review product in volume production. Read more >>