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Product Briefings

New Product: Straatum upgrades FDC software to virtual metrology status

01 July 2006 | Fab Management
Straatum ProcesswareProduct Briefing Outline: Straatum Processware has made further important upgrades to its real-time fault detection and classification (FDC) software for semiconductor manufacturing. ‘Imprint MX3' is a powerful, new version of its knowledge-based system for FDC with expanded advanced process control (APC) applications. Read more >>

New Product: PoU abatement system from TecHarmonic reaches 95 percent DRE

29 June 2006 | EHS
TecHarmonicProduct Briefing Outline: TecHarmonic Inc. has launched the Alpine-S, claiming that it is the industry's first and only point-of-use (PoU) gas abatement system with the capability to abate all process and perfluorocompound (PFC) gas emissions with destruction and removal efficiencies (DRE) well over 95 percent for both chemical vapor deposition (CVD) and etch applications. Read more >>

New Product: Applied Materials employs ‘virtual sensors’ in new APC platform

22 June 2006 | Wafer Processing
AMATProduct Briefing Outline: Applied Materials, has launched ‘NeXus SPC' its next generation advanced process control software and hardware, used exclusively on a range of Applied's 300mm process tools. The new diagnostic tool performs split-second analysis of process conditions which is critical information that can increase system uptime and yield, protect wafers from process drift and enable more cost-effective maintenance schedules. Currently, Applied customers employ the NeXus platform on more than 350 of its process systems worldwide. Read more >>

New Product: Entrepix starts ‘FastForward’ CMP foundry service

19 June 2006 | Wafer Processing
EnteprixProduct Briefing Outline: Entrepix' has launched its CMP ‘FastForward' foundry service that the company claims is the most extensive portfolio of CMP (chemical mechanical processing) processes, foundry services and equipment offerings to meet the semiconductor industry's rapidly growing interest in the Fab-Light manufacturing model. Read more >>

New Product: Piezo-driven nano-positioning from PI first in closed loop operation

14 June 2006 | Critical Components
PIProduct Briefing Outline: PI has introduced the world's first PCI-bus digital nano-positioning controller for closed-loop piezoelectric positioners & scanners. The new E-761 motion controller is designed to provide more flexibility and better overall value than any other digital piezo controller on the market today, according to the company. Read more >>

New Product: ChemTek gloves designed for HazMat operations

14 June 2006 | Cleanroom
ChemTekProduct Briefing Outline: Ansell Healthcare has produced a new ‘ChemTek' glove that is designed to provide the highest level of protection for handling hazardous chemicals in manufacturing and chemical processing environments. The new ChemTek product line is comprised of two different glove styles that offers chemical protection for first responders and others who may be faced with potentially hazardous or unknown substances. Read more >>

New Product: Ultrapure water lab level analysis for production applications

14 June 2006 | Cleanroom
GEProduct Briefing Outline: GE Analytical Instruments has introduced the Sievers 500 RL On-Line Total Organic Carbon (TOC) Analyzer. The reagentless analyzer is designed for continuous monitoring of organics in ultrapure water (UPW) for pharmaceutical, microelectronics, and power applications with a 0.03 ppb limit of detection and autozero capabilities, according to the company. Read more >>

New Product: Matera’s new automated SENTRY analyses harsh chemistries in fab

07 June 2006 | Materials and Gases
MateraProduct Briefing Outline: Metara has introduced the ‘SENTRY' Harsh Chemistry Metrology (HCM) system that the company claims is the first of its kind to be able in fully automated mode to analyze harsh ultra-pure chemicals for metallic contamination excursions. Read more >>

New Product: Cost sensitive thin film metrology systems from Rudolph Technologies

05 June 2006 | Wafer Processing
RudolphProduct Briefing Outline: Rudolph Technologies, has launched both the ‘S3000' and ‘S2000' ellipsometry-based metrology systems designed to provide high throughput, cost-effective measurements of thin transparent films in volume production environments. Read more >>

New Product: AP&S produces flexible wet bench with plug & run capability

24 May 2006 | Wafer Processing
AP&SProduct Briefing Outline: AP&S GmbH has launched its 2006 ‘MultiStep' automated wet bench. The platform, covers all applications for wet etching, layer thinning, surface cleaning and layer stripping of various materials and is claimed to offer a small footprint coupled to user-friendliness and reliability. Read more >>