Online information source for semiconductor professionals

Product Briefing Outline: Advanced Energy Industries has introduced a new product family of its Sekidenko optical fiber thermometers (OFTs) and emissometers. The new OR4000 product family provides non-contact temperature measurement for RTP, HDP-CVD, MO-CVD, UV cure and a variety of other semiconductor processes. The systems use a small, modular platform that has improved optical signal gathering, background subtraction techniques, and enhanced electronics resolution to provide a wider range of measurements and lower temperature capabilities, according to the company. Read more >>

Product Briefing Outline: Integrated Materials has added to its range of pure poly silicon furnace products with the introduction of a ‘SiFusion' liner for semiconductor furnace processes. According to the company the new product is now available in limited quantities for "beta" phase validation with the liner fixture completeing the SiFusion suite of furnaceware, which includes furnace boats, injectors and pedestals. SiFusion liners are already under qualification at fabs in Japan, Korea and Singapore. Initial performance data indicate unparalleled low particle levels when the SiFusion liner and boat are used together, according to the company. Read more >>

Product Briefing Outline: Carl Zeiss SMT's Nano Technology Systems division (Carl Zeiss NTS) and SII NanoTechnology Inc. (SIINT) have jointly introduced the XVision 300 Focused Ion Beam (FIB)/Scanning Electron Microscope (SEM) hybrid system. The XVision 300 is designed to enable ultra-high resolution, 3-dimensional surface and sub-surface process inspection and defect analysis on 300mm wafers at the 65/ 45nm node and beyond. The workstation, enables for dissection of high quality TEM lamellas from anywhere on a 300mm wafer. This is the first jointly developed product emerging out of the strategic alliance between the two respective companies earlier in 2006. Read more >>

Product Briefing Outline: Axcelis Technologies, has launched an Optima HD ion implanter, powered by ‘Imax,' for extremely high dose, low energy implant applications used for leading-edge memory and logic devices. The Optima HD Imax according to the company is designed to dramatically increase productivity and reduce low energy, high dose process times by implanting clusters of boron, instead of individual atoms.  The first Imax-enabled Optima HD tools will begin shipping by the end of the 2006. Read more >>

Product Briefing Outline: ATMI has introduced a new copper electrochemical deposition process for producing semiconductor chips with advanced copper interconnects in partnership with Enthone and Novellus Systems. The new chemistry and process were developed for Novellus Systems' SABRE tool for the 45nm process node. The ATMI-Enthone ‘Viaform Extreme' process is claimed to offer significant enhancements that meet stringent performance requirements for low defect rates, uniformity, and electrical performance.  The chemistry and associated processes have been validated at leading semiconductor manufacturers, according to the companies. Read more >>

Product Briefing Outline: Tokyo Electron Ltd. (TEL) has announced the release of the company's new Probing Accuracy Diagnosis System, TELPADS-O. Integrated with TEL's 300mm fully automatic wafer prober, the P-12XLm, the new system provides users with off-line, high speed probe mark inspection analysis. Read more >>

Product Briefing Outline: Applied Materials has combined advances in PVD titanium (Ti) and preclean technologies within the Applied ‘Endura' iLB II, to reduce resistance in critical contact structures by up to 40%, according to the company. The system's new PVD eSIP chamber deposits a Ti layer with improved uniformity on the wafer, plus  a claimed 30% greater bottom coverage over that of the previous system. In addition its ‘Siconi' Preclean chamber, an improved surface preparation technology for yield-critical transistor and contact interfaces, provides better removal of oxide from the contact bottom with minimal silicon loss. Read more >>

Product Briefing Outline: Applied Materials has made a significant enhancement to its Applied ‘Endura CuBS' (copper barrier/seed) system with the new ‘Aktiv' Preclean chamber, extending its capabilities for the  45nm node copper-low k interconnect process schemes. In addition to effectively removing polymeric residues and copper oxide from the interconnect, the Aktiv Preclean chamber is claimed to be the first preclean technology that effectively preserves the integrity of ultra-low k (k less than or equal to 2.5) dielectrics, resulting in up to 10% improvement in RC delay over previous reactive preclean technologies. Read more >>

Product Briefing Outline: Entegris has introduced its ‘LiquidLens' ultrapure water (UPW) purification system that is designed specifically for 193nm ArF immersion lithography systems. The sub-system combines advanced technology and process expertise from both Entegris and the former Mykrolis as a result of their merger in August 2005 to tackle high-purity issues associated with the needs of immersion lithography. Read more >>

Product Briefing Outline: Sopra has launched a new version of its spectroscopic metrology tool called the GES5 Evolution (GES5-E). The system is based on Ellipsometric porosimetry (EP), used to characterize CVD and spin coated porous ultra low-k materials. EP measures the change of the optical properties and thickness of the materials during adsorption and desorption of an organic solvent. The new system allows the complete characterization of porous thin layers for applications related to micro-electronics as well as new organic technologies. Read more >>