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Product Briefings

New Product: Applied Materials employs ‘virtual sensors’ in new APC platform

22 June 2006 | Wafer Processing
AMATProduct Briefing Outline: Applied Materials, has launched ‘NeXus SPC' its next generation advanced process control software and hardware, used exclusively on a range of Applied's 300mm process tools. The new diagnostic tool performs split-second analysis of process conditions which is critical information that can increase system uptime and yield, protect wafers from process drift and enable more cost-effective maintenance schedules. Currently, Applied customers employ the NeXus platform on more than 350 of its process systems worldwide. Read more >>

New Product: Entrepix starts ‘FastForward’ CMP foundry service

19 June 2006 | Wafer Processing
EnteprixProduct Briefing Outline: Entrepix' has launched its CMP ‘FastForward' foundry service that the company claims is the most extensive portfolio of CMP (chemical mechanical processing) processes, foundry services and equipment offerings to meet the semiconductor industry's rapidly growing interest in the Fab-Light manufacturing model. Read more >>

New Product: Piezo-driven nano-positioning from PI first in closed loop operation

14 June 2006 | Critical Components
PIProduct Briefing Outline: PI has introduced the world's first PCI-bus digital nano-positioning controller for closed-loop piezoelectric positioners & scanners. The new E-761 motion controller is designed to provide more flexibility and better overall value than any other digital piezo controller on the market today, according to the company. Read more >>

New Product: ChemTek gloves designed for HazMat operations

14 June 2006 | Cleanroom
ChemTekProduct Briefing Outline: Ansell Healthcare has produced a new ‘ChemTek' glove that is designed to provide the highest level of protection for handling hazardous chemicals in manufacturing and chemical processing environments. The new ChemTek product line is comprised of two different glove styles that offers chemical protection for first responders and others who may be faced with potentially hazardous or unknown substances. Read more >>

New Product: Ultrapure water lab level analysis for production applications

14 June 2006 | Cleanroom
GEProduct Briefing Outline: GE Analytical Instruments has introduced the Sievers 500 RL On-Line Total Organic Carbon (TOC) Analyzer. The reagentless analyzer is designed for continuous monitoring of organics in ultrapure water (UPW) for pharmaceutical, microelectronics, and power applications with a 0.03 ppb limit of detection and autozero capabilities, according to the company. Read more >>

New Product: Matera’s new automated SENTRY analyses harsh chemistries in fab

07 June 2006 | Materials and Gases
MateraProduct Briefing Outline: Metara has introduced the ‘SENTRY' Harsh Chemistry Metrology (HCM) system that the company claims is the first of its kind to be able in fully automated mode to analyze harsh ultra-pure chemicals for metallic contamination excursions. Read more >>

New Product: Cost sensitive thin film metrology systems from Rudolph Technologies

05 June 2006 | Wafer Processing
RudolphProduct Briefing Outline: Rudolph Technologies, has launched both the ‘S3000' and ‘S2000' ellipsometry-based metrology systems designed to provide high throughput, cost-effective measurements of thin transparent films in volume production environments. Read more >>

New Product: AP&S produces flexible wet bench with plug & run capability

24 May 2006 | Wafer Processing
AP&SProduct Briefing Outline: AP&S GmbH has launched its 2006 ‘MultiStep' automated wet bench. The platform, covers all applications for wet etching, layer thinning, surface cleaning and layer stripping of various materials and is claimed to offer a small footprint coupled to user-friendliness and reliability. Read more >>

New Product: JEOL’s JBX-6300FS direct write system offers 22nm imaging flexibility

24 May 2006 | Lithography
JEOLProduct Briefing Outline: JEOL, has introduced a new high precision direct write e-beam lithography system. The new JBX-6300FS is a spot beam, vector scan, step and repeat lithography system designed for high volume direct patterning on wafers, and is capable of writing minimum line widths of 8nm, according to the company. 2-inch to 200mm wafers can be accommodated, as well as parts and pieces. An autoloader allows continuous unattended operation of up to 10 cassettes under vacuum. Read more >>

New Product: Alternative to hydroxylamine based resist etch residue remover

24 May 2006 | Materials and Gases
BakerProduct Briefing Outline: Mallinckrodt Baker has introduced its ‘ALEG-380' photoresist stripper and residue remover as a cost-effective alternative to hydroxylamine-based chemistries in aluminum IC manufacturing processes. ALEG-380 is 100% water-soluble formulation that does not require an intermediate rinse, helping fabs improve yields and reduce manufacturing costs. Read more >>