Online information source for semiconductor professionals

Product Briefing Outline: Metron Technology has launched its ‘Aquareus' system, in what it claims is the semiconductor industry's first and only point-of-use (POU) solution for abating copper from a CMP system's effluent stream. The Aquareus system's simplified treatment process enables chipmakers to meet the stringent liquid discharge limits at a lower cost and with less risk than complex back-pad methods, according to the company. Problem: A typical CMP tool running in production generates effluent containing approximately one hundred kilograms of copper per year. Aquareus concentrates copper by a factor of 200:1 for greater efficiency and cost-effectiveness than back-pad copper abatement methods. The Aquareus system's point-of-use design allows process flexibility and incremental growth capability as semiconductor fab operations expand. Read more >>

Product Briefing Outline: Carl Zeiss SMT has announced the development of its lithography optical system, ‘Starlith' 1900i. The new system has a numerical aperture (NA) of 1.35, the highest NA currently designed, that will be used for volume chip production at 40nm half-pitch node. The system will be part of ASML's new ‘TWINSCAN' XT:1900i immersion lithography tool that will begin shipments in 2007. Read more >>

Product Briefing Outline: ASML has introduced the ‘TWINSCAN' XT:1900i. In combination with ASML proprietary low k1 capabilities, this new system is designed to extend optical immersion lithography for volume production at the 40nm half-pitch dimensions with an overlay specification of 6nm (SMO). ASML's newest 193-nm wavelength immersion scanner uses a 1.35 NA inline catadioptric lens assembly that is near the practical limit for water-based immersion technology. ASML expects to begin shipping the XT:1900i by mid 2007. Read more >>

Product Briefing Outline: Novellus Systems has launched its newest line of ‘GAMMA Express' dry photoresist dry strip high dose implant strip (HDIS) systems for 300mm wafer processing. A single product platform for both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications, GAMMA Express is claimed to provide the highest levels of technology, reliability and productivity for bulk strip and HDIS at the 65nm and 45nm nodes. The system is currently in beta evaluation with a large memory manufacturer in Asia, according to the company. Read more >>

Product Briefing Outline: Applied Materials has launched ‘NeXus SPC', its next generation advanced process control software and hardware, used exclusively on a range of Applied's 300mm process tools. The new diagnostic tool performs split-second analysis of process conditions which is critical information that can increase system uptime and yield, protect wafers from process drift and enable more cost-effective maintenance schedules. Currently, Applied customers employ the NeXus platform on more than 350 of its process systems worldwide. Read more >>

Product Briefing Outline: Brion Technologies has introduced the ‘Tachyon M3D,' computational technology to enable more accurate OPC and OPC verification by incorporating mask 3D imaging effects. Read more >>

Product Briefing Outline: Varian Semiconductor Equipment Associates has introduced its newest single wafer high current (SWHC) ion implanter, the ‘VIISta HCP'. This is a fifth generation SWHC product from Varian Semiconductor. According to the company, it has shipped multiple VIISta HCP systems into 65nm production and 45nm development. The systems have been accepted into high volume manufacturing and the company has received additional follow-on orders from leading logic, memory and foundry chipmakers. Read more >>

Product Briefing Outline: Nikon Corporation has introduced a new lithography tool that is designed to meet the requirements for mass production of 45nm memory and of 32nm logic devices. The NSR-S610C, an ArF immersion scanner, includes an advanced 1.30 NA projection lens and POLANO, Nikon's fourth generation polarization technology. The system will also include proprietary Nikon Local Fill Technology and the Tandem Stage, which enable the system to achieve a claimed throughput of 130 wafers or more per hour. Systems will start shipping by the end of 2006, according to the company. Read more >>

Product Briefing Outline: BOC Edwards has launched a new ‘EPMA'(electroplated metals abatement system) product, which offers simplified liquid waste treatment and lower cost of ownership than conventional approaches. Read more >>

Product Briefing Outline: Brooks Software, a division of Brooks Automation, has added a wide range of new functionality to its manufacturing execution system (MES) applications. ‘FACTORYworks', its core MES offering, has been enhanced significantly and is now available on the Microsoft Windows platform. ‘300works', an MES offering for highly-automated fabs has also been enhanced. The new functionality will, according to the company, improve productivity and make it easier to interoperate with enterprise-level applications. Read more >>