Online information source for semiconductor professionals

Product Briefing Outline: MKS Instruments has introduced the Low Pressure PiMFC Mass Flow Controller for maximum utilization of Safe Delivery Source gases used in semiconductor ion implant applications. It offers accurate and precise control of low gas flows, from below 1 sccm up to 20 sccm, over a wide pressure range with source gas delivery pressure as low as 4 Torr. Read more >>

Product Briefing Outline: GenISys GmbH has launched a new software tool for users of e-Beam lithography. The preparation of large layout data for e-beam direct write requires a highly efficient, flexible and robust framework for design and execution of complex processes including layout handling, processing, PEC, process modeling & correction, inspection and conversion to the machine format. GenISys' layout BEAMER 2.0, software is designed to speed data-prep processing and includes proximity effect correction (PEC) software that is specific to e-Beam lithography requirements. Read more >>

Product Briefing Outline: Advantest Corporation has introduced its new F3000 electron beam (EB) lithography system, which supports 300mm wafer process technology and 65nm rule devices and below. Utilizing Advantest's experience in high-resolution electron optical technology, the new system has a more rigid body and other improvements that achieve a 20% improvement over the previous model in image placement accuracy and critical dimension control, according to the company. Read more >>

Product Briefing Outline: KLA-Tencor has introduced the VisEdge CV300, 300mm wafer edge-inspection system, which uses Optical Surface Analyzer (OSA) technology from KLA-Tencor's acquisition of Candela Instruments. With many advanced IC manufacturers facing an average of 10 to 50 percent greater yield loss at the wafer's edge the tool's combination of optics design and defect classification capabilities allows IC manufacturers to overcome the limitations of existing edge-inspection techniques and enable broader capture and better distinction of edge defectivity to increase yield. KLA-Tencor will begin shipping the VisEdge CV300 to customers in the first calendar quarter of 2007. Read more >>

Product Briefing Outline: Partek, a division of Parker Hannifin, has introduced a new thermocouple sensor assembly, designated the TS Series, that is designed to provide reliable temperature monitoring for high-purity fluid systems which traditionally use fluoropolymer components. The sensor assembly overcomes perceived weaknesses with current thermocouple sensors that potentially reduce long term stability, and is expected to deliver considerable cost savings to users over its lifetime, according to the company. Read more >>

Product Briefing Outline: ILOG has unveiled the first software package to comprehensively address production scheduling for all essential front-end process areas within a 300mm fab. ILOG's ‘Fab PowerOps' software is claimed to create optimal, forward-looking production schedules for all tools within a given fab process area, as well as create new schedules every five minutes. FPO has already been used to optimize production scheduling at a leading-edge North American 300mm fab, according to the company. Read more >>

Product Briefing Outline: Synopsys Inc. has introduced a new family of process-aware design-for-manufacturing (PA-DFM) products that analyze variability effects at the custom/analog design stage for 45nm node and below. The PA-DFM product family's core products -- Synopsys Seismos and Paramos - link manufacturing variation information back to design, enabling custom IC (IP, cell, memory and analog) designers to optimize layouts and maximize yields. Read more >>

Product Briefing Outline: PDF Solutions Inc. has introduced a new release of its ‘Circuit Surfer' software for characterizing and optimizing the parametric yield of analog and radio frequency (RF) integrated circuit (IC) designs. The new release features the company's patented mismatch simulation technology, which helps to minimize the number of simulations required to characterize parametric yield. It is also claimed to reduce design re-spins by identifying parametric yield loss mechanisms not visible when using verification methods based on corner modeling. Read more >>

Product Briefing Outline: Tokyo Electron (TEL) has introduced the company's latest 300mm metal CVD (chemical vapor deposition) system ‘Trias' LT Ti/TiN. The new system enables deposition of Ti (Titanium) and TiN (Titanium Nitride) films in low
temperature process regimes. Based on the industry-proven Trias platform, the Trias LT Ti/TiN meets the increasing demands for low temperature processing required
in the manufacture of nickel silicide contacts, without the need to migrate to alternative technologies. Read more >>

Product Briefing Outline: Mattson Technology has entered the growing rapid thermal oxidation (RTO) market with the launch of ‘Atmos,' based on the Helios RTP platform. Atmos is a dual-chamber, single-wafer 300mm RTP system for high-volume chip manufacturing through the 32nm technology node. Atmos enables a broad range of RTO applications, including selective oxidation and shallow-trench isolation. The thermal oxidation market segment is forecasted (Gartner) to be $112.4 million in 2006, with a compound annual growth rate of 25.9 percent from 2005 to 2011. Mattson has already received multiple orders for the new system and recently shipped the Atmos to a leading integrated device manufacturer for qualification at the 70nm node and below. Read more >>