Online information source for semiconductor professionals

Product Briefing Outline: EV Group has introduced a new in-line metrology module for its EVG850TB automated temporary bonding and debonding systems.  This new metrology capability, which is now available as an option on the EVG850TB and EVG850DB platforms, allows customers to implement in-line process control for thin-wafer processing.  Read more >>

Product Briefing Outline: Applied Materials has launched the ‘Applied Reflexion GTTM’ CMP system to cater for the planarization of tungsten films. This CMP process is critical to fabricating the transistor contacts and vias in advanced DRAM, NAND and logic devices. With the Reflexion GT system's proven dual-wafer architecture, it is claimed to have the highest throughput and more than 40% lower cost-per-wafer than competing systems. The system offers closed-loop film thickness and uniformity control - a vital capability to achieve high yields of today's advanced transistor structures. Read more >>

Product Briefing Outline: KLA-Tencor has introduced the ‘SpectraShape' 8660 and 8810 dimensional metrology systems that feature ‘AcuShape 2’ modeling software developed jointly with Tokyo Electron. The new SpectraShape tools are able to fully characterize the three dimensional shapes of complex features on ICs and monitor these shapes at production speeds. The system employs a user interface that allows fab engineers to build models on their own, keeping the details of their proprietary IC structures in-house. Read more >>

Product Briefing Outline: Nikon’s new S620D incorporates a multi-axial catadioptric lens with a 1.35 NA that will satisfy the imaging requirements to enable DP for 32nm and future technology generations. This lens design delivers extremely low aberrations and minimized local flare. In addition, the S620D design enables active aberration control, and enhances CD uniformity with dose and focus feedback and tuning capabilities that further increase yield. The S620D has already satisfied the aggressive CDU requirements for lines and spaces at 32nm, and demonstrated 22nm patterning capabilities, confirming extendibility to next generation applications. Read more >>

Product Briefing Outline: Synopsys has introduced Proteus LRC for lithography verification at the 2011, SPIE Advanced Lithography conference. Proteus LRC provides comprehensive, process-window-aware checking features to identify locations in a design that are sensitive to process variations, thereby enabling corrective action to be taken prior to committing a design to manufacture. Proteus LRC is integrated into the Proteus Mask Synthesis flow and is targeted for use by OPC and mask data preparation groups at semiconductor manufacturers. Read more >>

Product Briefing Outline: At the 2011, SPIE Advanced Lithography Conference, Cymer has announced the development of new focus drilling technology for its immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300. According to Cymer, focus drilling provides up to a 2X improvement in the depth of focus on the wafer, thereby enabling a larger process window that can positively impact chipmakers' yield. Read more >>

Product Briefing Outline: Novellus Systems subsidiary, Peter Wolters has developed a new version of its microLine double side lapping system for prime silicon wafers. The new AC-2100L system features independently driven inner and outer pin rings, automatic force calibration, and in-situ wafer thickness metrology for closed-loop process control. The system can process up to twenty 300mm wafers in one batch, while exceeding the latest wafer geometry requirements. Read more >>

Product Briefing Outline: USHIO is to exhibit and participate in the SPIE Advanced Lithography 2011, highlighting a new nano-imprint VUV (Vacuum Ultra Violet) ashing system ‘CHIPs’ (Compact HiPower System), which is designed to be incorporated into nano-imprint lithography (NIL) equipment. Read more >>

Product Briefing Outline: Next generation semiconductor production will be facilitated by a new product introduced by Brion Technologies, a division of ASML.  Brion’s new Tachyon NXE is the result of a multi-year investment by ASML and Brion to accurately model the performance of NXE scanners, which are designed to provide accurate predictive modeling specifically for ASML Extreme Ultraviolet (EUV) scanners. The accurate EUV modeling in Tachyon NXE is claimed to reduce both the development time and cost to produce chips on EUV systems. Read more >>

Product Briefing Outline: Applied Materials has launched the ‘Applied UVision’ 4 wafer inspection system, enabling IC manufacturers to detect yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. UVision 4 extends Applied’s DUV laser imaging technology to deliver the sensitivity and productivity needed to rapidly locate and identify defects previously unseen by any other inspection system. The UVision 4 system is already the tool of record at multiple leading flash manufacturers where it is used for 32nm production and in the development of 22nm and EUV lithography processes. Read more >>