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Product Briefings

SPIE 2012: Tachyon FMO provides effective hotspot repair for advanced mask correction

13 February 2012 | Lithography
Product Outline: Brion Technologies, a division of ASML, has launched the Tachyon Flexible Mask Optimization (Tachyon FMO), part of ASML’s Holistic Lithography portfolio. Tachyon FMO is claimed to enable the seamless use of multiple Optical Proximity Correction (OPC) techniques in a single mask tapeout, permitting the use of advanced and computationally intensive OPC in key local areas where they provide maximum benefit. Read more >>

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy

19 September 2011 | Lithography
Product Briefing Outline: Applied Materials has introduced its new ‘Applied Centura Tetra’ EUV Advanced Reticle Etch system. The new systems is claimed to overcome a major hurdle to the adoption of EUV lithography by solving the critical and unmet challenge of etching EUVL photomasks with nanometer-level accuracy and world-class defect performance to enable the fabrication of multiple new generations of high-performance semiconductor chips at the 16nm node and below. Read more >>

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times

19 September 2011 | Lithography
Product Briefing Outline: Brion Technologies, a division of ASML, has launched a new product for its Tachyon computational lithography platform. Tachyon MB-SRAF (Model-Based Sub-Resolution Assist Features) is said to enable the high-speed, full-chip processing of advanced chip designs with larger process windows, greater productivity, and lower development costs than rule-based alternatives. Read more >>

EV Group unveils wafer bonding system for 450mm SOI wafers

13 July 2011 | Materials and Gases
Product Briefing Outline: EV Group has introduced the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. The EVG850SOI/450mm was created to support and facilitate the industry transition to 450mm wafers from the current 300mm standard. Read more >>

Surfscan SP3 from KLA-Tencor employs DUV illumination for higher defect sensitivity

13 July 2011 | Materials and Gases
Product Briefing Outline: KLA-Tencor has introduced a new generation to the ‘Surfscan’ family of wafer defect and surface quality inspection systems. The Surfscan SP3 is claimed to be the  first unpatterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination, enabling a dramatic improvement in sensitivity and throughput over KLA-Tencor’s previous offering, the Surfscan SP2XP. The Surfscan SP3 platform is also designed for extension to 450mm wafers. Read more >>

Novellus’ conformal film deposition suite offers 100% step coverage

12 July 2011 | Wafer Processing
Product Briefing Outline: Novellus Systems has launched the ‘VECTOR CFD’ family of films for the company’s VECTOR Express, VECTOR Extreme and VECTOR Excel plasma-enhanced chemical vapor deposition (PECVD) systems.  The Conformal Film Deposition (CFD) suite of dielectric films consists of oxide, doped oxide and nitride films are deposited at temperatures ranging from 50 degrees to 450 degrees Celsius.  These films provide solutions for emerging sub-2X nm logic and memory applications, including front-end-of-line (FEOL) liners and spacers used in tri-gate transistors and FinFETs, bitline spacers, and through silicon via (TSV) dielectric liners, amongst other applications. Read more >>

ASML enhances NXT:1950i immersion lithography platform

12 July 2011 | Lithography
Product Briefing Outline: ASML has introduced three new extensions for TWINSCAN NXT platform that improve imaging, overlay and productivity. The extensions enable chipmakers to manufacture smaller, faster chips more cost-effectively. The first NXT:1950i system shipped in 2009 and today more than 80 systems are in use by chipmakers around the world manufacturing current state-of-the-art devices at resolutions of 45- to 32-nm. Read more >>

Canon‚??s FPA-5510iV lithography tool designed for 3D packaging requirements

11 July 2011 | Lithography
Product Briefing Outline: Canon has entered the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV for next-generation semiconductor packaging, which is specially designed for ‘Through Silicon Via’ (TSV) and ‘bump’ processes. Read more >>

Rudolph releases faster ‚??Genesis Enterprise‚?? yield management software

08 July 2011 | Fab Management
Product Briefing Outline: Rudolph Technologies has released ‘Genesis Enterprise’ version 7.0. Genesis is an offline yield analysis and data mining software with parametric yield management tools designed to maximize factory efficiency and identify causes of yield loss. Since Rudolph’s acquisition of the Yield Dynamics software business from MKS Instruments a year ago, Rudolph have made significant performance improvements to the product. Read more >>

Applied Materials launches three new products for improving DRAM transistor performance

06 July 2011 | Wafer Processing
Product Briefing Outline: Applied Materials has launched a trio of new systems designed to boost performance in the next generations of DRAM chips. These systems are claimed to overcome key challenges in fabricating the transistor and contact areas of memory chips, include: the ‘Applied Centura DPN HD’ system to improve the gate insulator scaling; the ‘Applied Endura HAR Cobalt PVD’ system for high aspect ratio contact structures; and the ‘Applied Endura Versa XLR W PVD’ system for reduced gate stack resistance. Read more >>