Product Briefing Outline: Levitronix has introduced the new ‘BPS 600’ magnetically levitated pump technology, designed for demanding applications in the semiconductor industry such as CMP slurry delivery, copper electroplating and wafer cleaning at leading-edge process nodes. The patented impeller floats in a magnetic field only touching the fluid it is pumping, and can be fully integrated into a fully-closed loop electronic control system without the need of additional controller hardware. 

Product Briefing Outline: Edwards has introduced the new iXH series of vacuum pumps, used for harsh process environments. Designed to meet the increasing demands of the emerging processes required for semiconductor manufacturing at 60nm and smaller design rules, the iXH is designed to help reduce tool cost-of-ownership (CoO) with a smaller footprint than previous generations, and also features a modular design that enables a quicker response to emerging process requirements. 

Product Briefing Outline: Rohm and Haas Electronic Materials’ CMPTechnologies division has introduced the ‘VisionPad’ 5000 CMP pad, specifically designed for defectivity reduction in shallow trench isolation (STI) and interlayer dielectric (ILD) applications. The new pad targets volume manufacturing of memory and logic chips at 65nm and below.