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Ultra Clean shifts more manufacturing to Asia

18 February 2009 | Critical Components
Critical subsystems supplier Ultra Clean Holdings is continuing to consolidate manufacturing operations in the U.S. and shift additional manufacturing to Asia to reduce operating costs as its major customers see significant order declines in semiconductor, solar, and flat panel markets. Read more >>

IMEC, SRC join forces on environmentally friendly chipmaking initiative

18 February 2009 | EHS
cebsm_labEuropean nanoelectronics research center IMEC and the Semiconductor Research Corp. have signed a memorandum of understanding to set up an international collaboration aimed at the creation of novel, environmentally friendly processes and materials for advanced semiconductor manufacturing. The research will be conducted between IMEC and the joint SRC/Sematech Center for Environmentally Benign Semiconductor Manufacturing, a well-established organization known for its expertise in addressing strategic ESH-related research challenges. Read more >>

Sematech, Metrosol partner on advanced IC gate stack metrology

17 February 2009 | Wafer Processing
metrosolSematech and Metrosol have announced that the optical metrology company has joined the global chipmaker consortium's Front End Process Technologies program at the College of Nanoscale Science and Engineering of the University at Albany. The partnership will expand on collaborative efforts to develop suitable inline metrology techniques to monitor the thickness and composition of various films in high-k dielectric gate and memory stack structures in advanced integrated circuits.  Read more >>

NAND flash capex to fall nearly 60%, says DRAMeXchange

17 February 2009 | Fab Management
A combination of 200mm fab closures and slowing capacity expansions at existing 300mm fabs is expected to result in a NAND flash capital expenditure decline of 58.9% in 2009. NAND flash capex in 2008 declined 27.7% in 2008, compared to 2007, according to DRAMeXchange. Bit growth will decrease from 132.8% in 2008 to 63.5% Year-on-Year in 2009. In a previous report, DRAMeXchange had expected bit growth of 81% in 2009. Read more >>

Samsung and Micron gain most market share in DRAM crisis

17 February 2009 | Fab Management
Samsung and Micron gain most market share in DRAM crisisAccording to new market share figures from Gartner, both Samsung Electronics and Micron Technology have gained the most share in the DRAM market in the fourth quarter of 2008, as rivals struggle to preserve cash by cutting production. Samsung held a 29.5% market share in 3Q08 but saw this increase to 31.1% in the 4Q08, Gartner said. Micron saw its share increase from 8.8% in 3Q08 to 11.0% in 4Q08, due to strong bit growth. Micron also moved into fourth place in Gartner’s DRAM company rankings. Hynix also grew market share in the quarter, going from 18.9% in 3Q08 to 19.3% in 4Q08, retaining its second place ranking. Read more >>

ARM touts 32nm IBM Common Platform process availability in 2010

16 February 2009 | Wafer Processing
Using the IBM Common Platform 32nm process that incorporates High-K Metal Gate (HKMG), ARM has produced a test chip using its ‘Cortex’ family processor core, built with ARM Physical IP. ARM said that customers will have access to the technology in 2009, with full production release in early 2010. Read more >>

Applied Energy Systems takes over gas cabinet product line from Matheson Tri-Gas

12 February 2009 | Materials and Gases
Applied Energy Systems, Inc has acquired the ‘SEMI-GAS’ gas cabinet product line from Matheson Tri-Gas, Inc. The transaction and transfer that includes the technology and workforce is expected to be completed over the next few months. No disruption in orders and deliveries is expected with the transition, the companies said. Read more >>

ST-Ericsson formed as US$3.6 billion fabless wireless business

12 February 2009 | Fab Management
ST-Ericsson formed as US$3.6 billion fabless wireless business Not quite the fabless powerhouse that is rival Qualcomm with US$11 billion in revenues in 2008 but the recent merger of Ericsson Mobile Platforms and ST-NXP Wireless has received new branding as ST-Ericsson, which had US$3.6 billion in combined sales in 2008. ST-Ericsson has been positioned as a fabless semiconductor company, which will use STMicroelectronics fabs as well as pure-play foundries for front-end fabrication and assembly and test facilities operated by STMicroelectronics. Read more >>

Nanya pushes into mobile memory with Micron

12 February 2009 | Wafer Processing
Nanya Technology has seen the first fruits of its collaboration with Micron Technology as the manufacturing partners announced the development of low-power DDR2 (LPDDR2) DRAM technology for mobile and consumer products. This is the first time Nanya has targeted this market sector, traditionally being a DRAM producer targeting the mainstream PC market. Read more >>

Luminescent claims growing customer base for its ‘Inverse’ litho technology

12 February 2009 | Lithography
Luminescent claims growing customer base for its ‘Inverse’ litho technologyComputational lithography start-up, Luminescent Technologies, has claimed a growing customer base for its Inverse Lithography Technology (ILT). Customers now include DRAM, logic and microprocessor manufacturers and are located in Europe, Japan, Korea, Taiwan, and the U.S. Read more >>