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Tool Order: Axcelis wins follow-on order for Optima HDx

11 February 2010 | Wafer Processing
A leading chip manufacturer has placed a follow-on order with Axcelis Technologies for its Optima HDx high current implanter. Axcelis said that the customer had used the system in another fab and would now expand its adoption of the tool at its newest facility. Read more >>

Novellus joins IBM and CNSE on resist strip process development

11 February 2010 | Wafer Processing
The GxT and G400 are photoresist strip systems A new technology development collaboration has been established between Novellus Systems, IBM and the College of Nanoscale Science and Engineering (CNSE) at CNSE’s Albany NanoTech Complex to develop advanced, residue-free photoresist strip technologies for leading-edge processes for the 28nm and 22nm nodes.
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Micron claims title of second largest memory producer following Numonyx acquisition

11 February 2010 | Fab Management
In the acquisition of primarily NOR flash manufacturer Numonyx, which was a joint venture between Intel Corporation, STMicroelectronics and Francisco Partners, Micron Technology’s, Chairman and CEO Steve Appleton noted in a conference call that the newly combined organization would have the second-largest share of the memory market after Samsung. Appleton claimed that it would 19% share, with Samsung holding 29% and slightly more that 17% share noted for Hynix, which has been the longstanding number 2 in the market. Privately held Numonyx was acquired by Micron, via an all-stock transaction valuing Numonyx at approximately US$1.27 billion. Read more >>

Tool Order: Hamamatsu Photonics selects NIL system from Obducat

09 February 2010 | Lithography
Hamamatsu Photonics has placed an order for an Obducat NIL system through its sales partner in Japan, Canon Marketing Japan. The NIL system will be used in product development and pilot production of new optical devices. Obducat said that Hamamatsu based their selection on imprint quality, the industrial track record of Obducat and the strong local support from Canon. Read more >>

ASML joins SEMATECH’s EUV lithography program

09 February 2010 | Lithography
ASML has joined SEMATECH’s Lithography program at the College of  Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex to further develop EUV lithography to ensure its future adoption. ASML already partners with IMEC on EUV technology and infrastructure development. CNSE also has an ASML built EUV ‘Alpha’ tool. Read more >>

VLSI Research awards Oerlikon Systems a Five Star customer satisfaction rating

09 February 2010 | Fab Management
VLSI Research has awarded Oerlikon Systems a ‘five star rating’ for customer satisfaction in 2009. The five star ratings are handed out by chip equipment users (representing 95% of the world’s semiconductor market) and compiled by VLSI Research as part of their 2009 Customer Satisfaction Report. Read more >>

Micron, Nanya develop 42nm copper DRAM; production 2H 2010

09 February 2010 | Wafer Processing
Production partners Micron Technology and Nanya Technology had developed a 42nm DDR3 DRAM device that uses copper metalization with 2Gb density. The new 42nm process now makes 1.35-volts the standard, mainstream voltage requirement, compared to 1.5-volt with previous generations. The partners are also preparing a 3X node migration, which is being developed in R&D. Read more >>

Linde’s new dopant gas range lowers ion implantation costs by 20%

05 February 2010 | Materials and Gases
LindeLinde North America has launched its new sub-atmospheric dopant gas source for the semiconductor and related industries. The Genii Sub-Atmospheric Gas Sources are used for ion implantation and use chemical complexing or electrochemical generation to deliver a high performance as required by IC manufacturers. Read more >>

Tool Order: Major logic foundry places follow-on order for Ultratech’s LSA systems

05 February 2010 | Wafer Processing
A Major logic foundry based in Asia has placed a multiple systems follow-on order with Ultratech for its laser spike anneal (LSA) tool. Ultratech's LSA100A systems will be used to support high-volume production for advanced logic devices in 2010. Ultratech said that all major logic foundries now used this tool.
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UMC sets 2010 capex budget at more than double ’09 levels

05 February 2010 | Fab Management
Continuing its conservative approach to capital expenditure and capacity additions, UMC is raising CapEx for 2010 to between US$1.2 and US$1.5 billion. CapEx for 2009 was reported as US$550 million. The increased spending was due to strong demand for leading-edge technology, which is capacity constrained at its two, 300mm fabs. UMC said that overall fab utilization fell slightly in the fourth quarter to 86%, down from 89% in the seasonally strong third quarter. Utilization rates are expected to remain in the high-80’s for the first quarter of 2010 and wafer shipments to be flat with the previous quarter. Read more >>