Online information source for semiconductor professionals

A leading chip manufacturer has placed a follow-on order with Axcelis Technologies for its Optima HDx high current implanter. Axcelis said that the customer had used the system in another fab and would now expand its adoption of the tool at its newest facility. Read more >>

A new technology development collaboration has been established between Novellus Systems, IBM and the College of Nanoscale Science and Engineering (CNSE) at CNSE’s Albany NanoTech Complex to develop advanced, residue-free photoresist strip technologies for leading-edge processes for the 28nm and 22nm nodes.
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In the acquisition of primarily NOR flash manufacturer Numonyx, which was a joint venture between Intel Corporation, STMicroelectronics and Francisco Partners, Micron Technology’s, Chairman and CEO Steve Appleton noted in a conference call that the newly combined organization would have the second-largest share of the memory market after Samsung. Appleton claimed that it would 19% share, with Samsung holding 29% and slightly more that 17% share noted for Hynix, which has been the longstanding number 2 in the market. Privately held Numonyx was acquired by Micron, via an all-stock transaction valuing Numonyx at approximately US$1.27 billion. Read more >>

Hamamatsu Photonics has placed an order for an Obducat NIL system through its sales partner in Japan, Canon Marketing Japan. The NIL system will be used in product development and pilot production of new optical devices. Obducat said that Hamamatsu based their selection on imprint quality, the industrial track record of Obducat and the strong local support from Canon. Read more >>

ASML has joined SEMATECH’s Lithography program at the College of  Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex to further develop EUV lithography to ensure its future adoption. ASML already partners with IMEC on EUV technology and infrastructure development. CNSE also has an ASML built EUV ‘Alpha’ tool. Read more >>

VLSI Research has awarded Oerlikon Systems a ‘five star rating’ for customer satisfaction in 2009. The five star ratings are handed out by chip equipment users (representing 95% of the world’s semiconductor market) and compiled by VLSI Research as part of their 2009 Customer Satisfaction Report. Read more >>

Production partners Micron Technology and Nanya Technology had developed a 42nm DDR3 DRAM device that uses copper metalization with 2Gb density. The new 42nm process now makes 1.35-volts the standard, mainstream voltage requirement, compared to 1.5-volt with previous generations. The partners are also preparing a 3X node migration, which is being developed in R&D. Read more >>

Linde North America has launched its new sub-atmospheric dopant gas source for the semiconductor and related industries. The Genii Sub-Atmospheric Gas Sources are used for ion implantation and use chemical complexing or electrochemical generation to deliver a high performance as required by IC manufacturers. Read more >>

A Major logic foundry based in Asia has placed a multiple systems follow-on order with Ultratech for its laser spike anneal (LSA) tool. Ultratech's LSA100A systems will be used to support high-volume production for advanced logic devices in 2010. Ultratech said that all major logic foundries now used this tool.
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Continuing its conservative approach to capital expenditure and capacity additions, UMC is raising CapEx for 2010 to between US$1.2 and US$1.5 billion. CapEx for 2009 was reported as US$550 million. The increased spending was due to strong demand for leading-edge technology, which is capacity constrained at its two, 300mm fabs. UMC said that overall fab utilization fell slightly in the fourth quarter to 86%, down from 89% in the seasonally strong third quarter. Utilization rates are expected to remain in the high-80’s for the first quarter of 2010 and wafer shipments to be flat with the previous quarter. Read more >>