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Tool Order: FSI to supply ‘ORION’ single wafer cleaning system

18 March 2010 | Wafer Processing
‘ORION’ single wafer cleaning system from FSI InternationalA major semiconductor manufacturer based in Asia has selected an ‘ORION’ single wafer cleaning system from FSI International to meet anticipated resist stripping requirements for front-end-of-line (FEOL) cleaning processes in advanced IC manufacturing. FSI expects to ship this evaluation FSI ORION single wafer cleaning system to this customer during its fiscal 2010 third quarter. Read more >>

Global semiconductor materials market contracted 19% in 2009

18 March 2010 | Materials and Gases
Semiconductor Materials Market by World RegionAlthough the drastic nature of the production cuts in the first half of 2009 impacted demand for semiconductor materials, the second half recovery saw the materials market only contract 19%, according to a new report from SEMI. In the last major downturn in 2001, the materials market decline 26%. Semiconductor materials market revenues totalled US$34.6 billion globally in 2009, while total wafer fabrication materials and packaging materials were US$17.9 billion and US$16.8 billion, respectively. Silicon revenues contributed to the year-over-year decline in the wafer fabrication materials market. Read more >>

Tool Order: Taiwan foundry to use Camtek’s Automatic Optical Inspection for 3D IC process

16 March 2010 | Wafer Processing
Camtek's Falcon Automatic Optical Inspection (AOI) systemA leading foundry in Taiwan has selected Camtek's Falcon Automatic Optical Inspection (AOI) system, for metrology and inspection solutions for the 3D IC processes. The Falcon 830plus system was evaluated and selected over its competitors after demonstrating the best-of-breed performance in this challenging arena, according to the company. Read more >>

MEMC becomes member of SOI Industry Consortium

16 March 2010 | Materials and Gases
Having been developing SOI technology in house for many years and can offer partially depleted SOI, fully depleted SOI, strained SOI and other SiGe-on-insulator substrates has finally joined the SOI Industry Consortium. Read more >>

Gartner expects 29.5% growth in semiconductor silicon wafer demand in 2010

16 March 2010 | Materials and Gases
A return to normal seasonal IC demand dynamics coupled to a rebuild in inventory levels from ICs though to silicon wafers will push wafer demand up nearly 30% in 2010, according to Gartner. Wafer demand in the fourth quarter of 2009 is estimated to increase 7% compared with the preceding quarter and is expected to grow a further 2 to 3% in the third and fourth quarters. Read more >>

CSMC using SOI wafers from Soitec for high voltage IC applications

16 March 2010 | Materials and Gases
China-based analog specialty foundry, CSMC Technologies (CSMC) is using SOI wafers from Soitec for high voltage IC applications, initially aimed for colour plasma display panel (PDP) driver ICs and other mixed signal and analog applications. Read more >>

Profits rule over fab capacity expansions says iSuppli

15 March 2010 | Fab Management
 Profitability of semiconductor manufacturers increased to 21.4% in the fourth quarter of 2009Profitability of semiconductor manufacturers increased to 21.4% in the fourth quarter of 2009, the highest level since the fourth quarter of 2000 when it reached 24.7%, according to new data from iSuppli Corp. Although the rebound is partly due to the recovery in the market, the market research firm believes that the improved profitability is also a condition of reduced capital expenditures and other cost management strategies. Read more >>

Qimonda’s 300mm equipment at Dresden fab set for auction

15 March 2010 | Fab Management
As part of the wrapping-up of the former DRAM memory producer, Qimonda an online auction of approximately 100 tools from its 300mm front-end fabrication operations in Dresden is set to start on March 16th, 2010 and to close on Tuesday  March 30th 2010. The majority of the tool set at Qimonda’s 300mm fab in Richmond, Virginia was previously block-sold to Texas Instruments. Read more >>

IMEC to use TCAD tools from Synopsys for 3D stacked IC TSVs

09 March 2010 | Wafer Processing
IMEC is to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs) as part of the nano-electronics research centre’s to accelerate development efforts.
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IC Insights revises semiconductor forecast: Market could top 2007 record revenue

09 March 2010 | Fab Management
IC Insights, Bill McCleanIn the March update to The McClean Report, IC Insights is now forecasting that the worldwide IC market is expected to rebound 27% in 2010 to US$253 billion. At the beginning of the year, the market research firm expected a 15% growth over 2009, though had then suggested that should first quarter sales show any growth over fourth quarter 2009, then a 25% plus growth figure would occur. The first quarter is seasonally the weakest in a given year in the industry. IC Insights believes that preliminary data shows that the first quarter saw revenue grow 3% over fourth quarter figures. Read more >>