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Tool Order: Qcept Technologies gains strategic partner

17 May 2011 | Wafer Processing
ChemetriQ 5000 A leading semiconductor capital equipment manufacturer has formed an applications development relationship with non-visual defect (NVD) inspection technology supplier, Qcept Technologies. The customer will purchase Qcept’s latest-generation ChemetriQ 5000 NVD inspection system, which is planned to be shipped and installed at the customer site during the second quarter of 2011.  Read more >>

Tool Order: Major foundry orders US$10 million worth of Bruker metrology tools

12 May 2011 | Wafer Processing
Bruker's InSight 3D Atomic Force MicroscopeBruker has received over US$10 million in orders for its metrology tools from an unnamed global semiconductor foundry. Bruker will supply a range of its products, including the fully automated InSight 3D atomic force microscopes (AFMs), D8 Fabline and D8 Discover X-ray diffraction systems and the S2 Picofox portable bench-top TXRF spectrometers to the company. Read more >>

TSMC joins Sematech for 20nm IC development

11 May 2011 | Wafer Processing
TSMCSematech has added another major foundry to its ranks in the form of TSMC. This new relationship will see the two companies collaborate on advanced technology development for IC process technologies for the 20nm generation and beyond. These will include extreme ultraviolet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and will also involve a focus on advances needed for the transition to the 450mm wafer size. Read more >>

Applied Materials to acquire Varian Semiconductor for US$4.9 billion.

04 May 2011 | Wafer Processing
Ion implant market leader, Varian Semiconductor Equipment Associates is to be acquired by Applied Materials for approximately US$4.9 billion. The deal is said to enhance Applied’s product offerings for transistor formation for front-end semiconductor processing as IC process complexity, transistor scaling and 3-D design implementation require complete and integrated product and process offerings. The deal also offers Applied new market opportunities in solar, display and light emitting diodes, where Varian has made significant investments in recent years to broaden implant technologies market opportunities. Varian reported last week that its second quarter 2011 revenue was US$330 million. Applied previously exited the ion implant market, closing the unit based in the UK in 2007. Read more >>

Order Focus: Camtek get follow-on order for Gannet system from Asia-based IDM

03 May 2011 | Wafer Processing
A leading Asian Integrated Device Manufacturer (IDM) has placed a follow-on order with Camtek for its ‘Gannet’ Automatic Optical Inspection (AOI) system, used for front-end semiconductor applications. Camtek said the systems are expected to be installed during the second quarter of 2011. Read more >>

Elpida to ramp 30nm DRAM in May

28 April 2011 | Wafer Processing
Elpida Memory is on target to start the ramp of 30nm DRAM at its Hiroshima Plant as well as at Taiwan-based Rexchip Electronics Corporation starting in May, 2011. Mass production is expected to start with a 30nm 2-gigabit DDR3 SDRAM for PC applications, followed by 4-gigabit DDR2 Mobile RAMTM and 4-gigabit DDR3 SDRAM. Elpida said its 300mm fab would be devoting 20% of its production capacity to the new 30nm process by the second quarter of CY 2011. Read more >>

Tool Order: SPTS wins multi-systems order for through silicon via TSV structures for 3D-IC packaging

26 April 2011 | Wafer Processing
SPTS Omega Etch fabricating a scallo-free TSVA multi-system and product order has been hailed as marking a new market penetration for SPP Process Technology Systems (SPTS), which includes a suite of equipment to be used for the fabrication of through silicon via (TSV) structures for 3D-IC packaging. Customer details were not disclosed except that the order was placed by a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region. Read more >>

SEMATECH attracts six more semiconductor firms to 3D TSV IC program

26 April 2011 | Wafer Processing
A slew of semiconductor firms have joined a growing list of companies collaborating with SEMATECH’s 3D Enablement program based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to develop TSV-based 3D stacked IC solutions. New partners include Advanced Semiconductor Engineering (ASE), Altera, Analog, LSI, ON Semiconductor, and Qualcomm. Read more >>

Applied Materials to joint set-up ‘Center of Excellence’ in advanced packaging in Singapore

13 April 2011 | Wafer Processing
Already a member of numerous advanced packaging programs, especially related to 3D IC packaging technology, Applied Materials is also establishing a Center of Excellence in advanced packaging in Singapore in joint collaboration with the Singapore Agency for Science, Technology and Research (A*STAR). The center will be located at Singapore’s Science Park II and will focus on developing new capabilities in advanced packaging which has long been touted as a key growth market for the semiconductor industry. Read more >>

RRAM technology start-up joins SEMATECH‚??s next-gen memory program

12 April 2011 | Wafer Processing
Silicon Valley start-up, 4DS a developer of next generation RRAM technology has joined SEMATECH's Front End Processes (FEP) to partner on efforts in non-volatile memory technology development.  RRAM is seen by industry experts as an attractive replacement for FLASH memory and as a complement for non-volatile memory applications due to its speed, power profile and scaling.  Read more >>