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SELETE completes 65nm CMOS logic process

04 February 2005 | Wafer Processing
Semiconductor Leading Edge Technologies Inc, (SELETE) the Japanese led IC manufacturers consortium has concluded process development work on "hp 65nm" node CMOS process modules. Read more >>

ASM pushes porous low-k for 65nm

04 February 2005 | Wafer Processing
ASM International has claimed a breakthrough "Pore Sealing Process," using its "Eagle" PECVD system for porous low-k insulator materials to potentially be used with copper interconnects at the 65nm node. Read more >>

Texas Instruments targets 90nm process for 300mm wafers

04 February 2005 | Wafer Processing
Texas Instruments announced late in October 2004 that it had qualified its advanced 90nm copper process on 300mm wafers in its DMOS6 facility. The result of the migration of the 90nm process to 300mm wafers allows TI to deliver up to 2.4 times more die per wafer over 200mm, and reduces production costs 30 - 40 percent. The first products to result from the qualified 90nm, 300mm process include wireless baseband processors for advanced mobile handset devices. Read more >>

SMIC readies 90nm logic process

04 February 2005 | Wafer Processing
The Chinese foundry plans to offer 90nm process technology for logic devices in the first six months of 2005. The Company has signed a foundry contract with Texas Instruments for a full-flow 90nm process technology. Contrary to some news reports the 90nm process is being developed by SMIC and is not a licensed or TI hybrid process. TI has been using the Chinese foundry for BEOL processing only but is now planning to have fully fabricated 90nm chips from SMIC sometime in the 2H05. It is not yet known whether this will be 200mm or 300mm wafers. Read more >>

AMD aims fast ramp pf 90nm 300mm wafer process

04 February 2005 | Wafer Processing
ATDF, the R&D lab spun-off from Sematech will process  approximately five thousand 300mm wafers for AMD to support the initial qualification and ramp the chip-maker's new, $2.4 billion Fab 36 in Dresden, Germany. Read more >>

Power hungry FPGAs get fix at 90nm

04 February 2005 | Wafer Processing
Altera Corporation in conjunction with Bellnix Co, Ltd., Linear Technology, National Semiconductor, Texas Instruments and Volterra Semiconductor claim they now have available a complete power management solution for users of Altera's FPGAs. This collaboration, including the introduction of new PowerPlay technology in Quartus II software version 4.2, helps customers manage power consumption while optimizing the performance of their Stratix II designs. Read more >>

Toshiba and NEC develop high-density MRAM

04 February 2005 | Wafer Processing
Toshiba Corporation and NEC Corporation announced two key advancements toward development of a magnetoresistive random access memory, at the International Electron Devices Meeting (IEDM) 2004 in San Francisco, USA. Read more >>

Silterra demonstrates 130nm 8-Megabit SRAM

04 February 2005 | Wafer Processing
The Joint Development Project (JDP) between Silterra Malaysia Sdn. Bhd. and IMEC, has resulted in functional SRAM chips at Silterra's wafer fabrication facility in Malaysia. The device, an 8- megabit SRAM, was fabricated in the all-copper, foundry compatible 130nm CMOS process technology jointly developed by both companies. Read more >>

Toshiba and NEC develop high-density MRAM

04 February 2005 | Wafer Processing
Toshiba Corporation and NEC Corporation announced two key advancements toward development of a magnetoresistive random access memory, at the International Electron Devices Meeting (IEDM) 2004 in San Francisco, USA.Read more >>

Tool Order News Focus

04 February 2005 | Wafer Processing
Advanced Micro Devices has placed a major order with Applied Materials for 300mm equipment to manufacture its future advanced 65nm-generation 64-bit microprocessors. The orders cover a broad range of process technologies, including Applied's most advanced etch systems, as well as a comprehensive suite of metrology and inspection tools. The systems began shipping in late 2004. AMD selected several types of etchers, including the company's latest Applied Centura Enabler and Producer Dielectric Etch systems for etching advanced copper/low k interconnects.AMD also chose the new high-throughput, high-resolution Applied VeritySEM Metrology CD-SEM, the Applied SEMVision FIB (focused ion beam) defect analysis system and the ComPlus wafer inspection system. Applied Materials was selected as AMD's exclusive supplier of high current, low energy implant technology with its purchase of Applied Quantum® X Implant systems. Read more >>