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Semiconductor book-to-bill ratio flat but bookings remain high

17 June 2011 | Wafer Processing
Semiconductor equipment bookings and the book-to-bill ratio for the month of May were flat with the previous month, though bookings remain higher than the same month a year ago. North America-based manufacturers of semiconductor equipment posted $1.62 billion in orders in May 2011 (three-month average basis) and a book-to-bill ratio of 0.97, according to the May Book-to-Bill Report published today by SEMI. Read more >>

Metryx to collaborate with Intel and imec on mass metrology applications at the 20nm node

14 June 2011 | Wafer Processing
As part of the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project, UK-based mass metrology form, Metryx will be working with imec and Intel Corproation to assess the use of high-resolution mass metrology at the 20nm node and below. The use of mass metrology to gauge the deposition process accuracies amongst many applications for the technology is believed to increase as node-migrations continue. Read more >>

Veeco gets US government funding for LED manufacturing equipment

13 June 2011 | Wafer Processing
TurboDisc MaxBright GaN MOCVD Multi-Reactor SystemThe U.S. Department of Energy has awarded Veeco Instruments US$4 million in R&D funding for a project designed to use novel materials, substrates, and deposition technologies to produce lower cost LED’s. US Energy Secretary, Steven Chu announced nearly US$15 million to support eight new research and development projects that will accelerate the development and deployment of high-efficiency solid state lighting technologies like LEDs and organic LEDs (OLEDs). Veeco is matching the funding.
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Tool Order: UMC places US$25.7 million order with Lam Research

13 June 2011 | Wafer Processing
Equipment supplier, Lam Research has received a US$25.7 million order from UMC. The 300mm tool order is for the foundry’s fabs based in Taichung City area. Lam Research has been a long-standing supplier to UMC, though the type of tools ordered were not disclosed by UMC in a TWSE filing. Read more >>

Fabless companies extend research programs at imec

26 May 2011 | Wafer Processing
Several fabless semiconductor firms such as Qualcomm, Nvidia and Altera are working ever closer with imec on future challenges for semiconductor devices, especially in the fields of design and process integration. imec and Qualcomm are broadening research on 3D technologies to identify system design impacts of 3D and advanced process technologies including device structures, interconnects and lithography for the sub-20nm node. Qualcomm has participated in the imec industrial affiliation program (IIAP) since 2008. Read more >>

TowerJazz taps Singapore‚??s IME for MEMS development

25 May 2011 | Wafer Processing
Hoping to make micro-electro-mechanical systems (MEMS) applications a better revenue stream for TowerJazz, the specialty foundry has touted a technology partnership with Institute of Microelectronics (IME) of Singapore. The institute is known for gelling fabless or fab-lite companies with R&D programs that can quickly transition to foundries for prototyping and possible production. Read more >>

Order focus: TSMC returns to capital spending foray

25 May 2011 | Wafer Processing
After about a month of little if any announced equipment purchases, TSMC has kicked-off a new wave of spending worth a total of approximately US$172.2 million. Equipment companies receiving new purchase orders include Applied Materials, Dainippon Screen, HamaTech APE, Toyko Electron and Varian Semiconductor. The largest purchase order placed by TSMC was with Applied Materials, valued at approximately US$91.6 million. The second largest order was placed with Varian Semiconductor, valued at approximately US$35.4 million. Applied Materials is acquiring the ion implant firm. Read more >>

SEMI book-to-bill ratio continues to climb

20 May 2011 | Wafer Processing
The upward trend has continued through to April with the book-to-bill ratio reaching 0.98, up from 0.85 at the beginning of the year. North America-based manufacturers of semiconductor equipment posted US$1.60 billion in new orders for April, which is 1.1% more than the final March 2011 level of $1.58 billion, and is 10.8% above the US$1.44 billion in orders posted in April 2010. Read more >>

Advanced probe cards lead sales growth according to VLSI Research

19 May 2011 | Wafer Processing
A new report from VLSI Research highlights that there was a marked switch away from cantilever probe cards in favour of advanced probe cards in 2010. Advanced probe cards accounted for 72% of revenues in the equipment segment last year compared to 68% in 2009. In 2011, sales of semiconductor probe cards, including spares and service, are forecast to grow by 10.6% to US$1,151 million, according to the market research firm. Read more >>

Tool Order: Akrion ships 300mm ‚??Velocity‚?? system to Asia

19 May 2011 | Wafer Processing
A leading-edge memory products manufacturer in Asia is to receive a 300mm ‘Velocity’ single wafer cleaning system from Akrion Systems, which will be used for  the purpose of demonstrating its pre-lithography cleaning capabilities. Read more >>